WMSIC Electronic Components

RUILON NTC8D-7 NTC8D

ModelNTC8D-7
PackageThrough-hole, P=5mm
BrandRUILON
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
RUILON NTC8D-7
Type
RUILON
Minimum package
1000 袋

Technical parameters

Electronic Component
Electronic Component
Electronic Component
RUILON
Electronic Component
NTC8D-7
Electronic Component
1
Electronic Component
5mm
Package
Through-hole, P=5mm
Electronic Component
NTCThermistor Resistor
Electronic Component
0.444g
Electronic Component
8Ω
Pitch
5mm
Electronic Component
1
(φD)
7mm
Electronic Component
BM0258753253
Operating Temperature
40℃~+150℃
Resistor
±20%
Electronic Component
9mW/℃

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

NTC8D-7 产品概述

一、产品简介

NTC8D-7 为 RUILON(瑞隆源) 系列片式敏感电阻(负温度系数热敏电阻),标称阻值 8Ω(25℃),B 值 2700K(25℃/50℃)。为插件封装,脚间距 P=5mm,适合通过孔安装的温度检测与补偿应用。典型应用包括温度检测、温度补偿、温度报警与控制电路中的敏感元件。

二、主要参数与含义

  • 阻值(25℃):8Ω(R25)
  • B 值(25℃→50℃):2700K,表示热敏电阻随温度变化的指数系数,计算关系:R(T)=R25·exp[B(1/T − 1/T25)](T 单位为开尔文)
  • 电阻精度:±20%,出厂值允许波动,需在系统中校准或选用配对件
  • 最大稳态电流(25℃):1A(注意需按热功耗与散热条件使用)
  • 工作温度:-40℃ ~ +150℃
  • 耗散系数(热耗散常数):9 mW/℃(即升高 1℃ 所需约 9 mW 功耗)
  • 热时间常数:30 s(温度阶跃变化时约 63% 响应时间)

三、热学与电学计算示例(设计参考)

  • 功率计算:P = I^2 · R。若按标称 1A,P = 1^2×8 = 8 W(此功耗非常大,实际会导致器件过热)。
  • 温升估算:ΔT ≈ P / Pd,其中 Pd=0.009 W/℃(耗散系数)。例如 P=8 W 时 ΔT ≈ 8 / 0.009 ≈ 889℃(显然超出器件允许)。
  • 实际连续工作电流建议按热平衡限值设计:若以环境 25℃、器件最高允许温度 150℃(可承受升高 125℃)为限,允许功耗约 P_allow = Pd × 125 ≈ 1.125 W,对应连续电流 I_max ≈ sqrt(P_allow / R) ≈ 0.375 A。由此可见在无额外散热条件下,应远低于标称 1A,1A 更可能为短时脉冲或特殊测试条件下的极限值。设计时应留足裕量并考虑散热措施。

四、典型应用场景

  • 温度检测与温度补偿传感器(家电、仪表、充电保护等)
  • 温度触发报警与限温控制
  • 需要较快响应但非功率限流的温度检测点(热时间常数 30 s,为中等响应速度)

五、安装、测量与注意事项

  • 插件安装时避免对敏感体施加机械应力,焊接时控制温度与时间,防止高温长时焊接损伤特性;若需二次加工建议使用热沉或快速焊接工艺。
  • 测量温度时常以 25℃ 为校准点;温度换算使用上述 B 型公式或查表法以提高精度。
  • 由于电阻精度为 ±20%,需在系统中通过软件或外部补偿校准;批量选配可降低误差。
  • 环境与封装对热响应影响大:封装填充或胶封会增加热时间常数并改变耗散系数,设计时应按实际安装条件重新评估。
  • 注意避免长期在接近或超过最高工作温度下运行,必要时加散热或限制电流/占空比。

六、包装与储存

  • 建议干燥、通风、避免强酸强碱腐蚀环境保存;长期库存应避免高温、高湿直射阳光。
  • 出货包装按厂家标准,运输与存储时防止机械冲击与潮湿。

如需用于特定应用(例如严格温度测量、短时大电流脉冲或表面贴装替代)可提供应用电路建议与热仿真支持,以确保器件在实际工况下可靠工作。

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