WMSIC Electronic Components

RUILON NTC 3D-15 NTC

ModelNTC 3D-15
PackageThrough-hole, P=7.5mm
BrandRUILON
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
RUILON NTC 3D-15
Type
RUILON
Minimum package
250 袋装

Technical parameters

Electronic Component
Electronic Component
Electronic Component
RUILON
Electronic Component
NTC 3D-15
Electronic Component
1
Electronic Component
6mm
Package
Through-hole, P=7.5mm
Electronic Component
NTCThermistor Resistor
Electronic Component
0.788g
Electronic Component
3Ω
Pitch
7.5mm
Electronic Component
1
(φD)
15mm
Electronic Component
BM0255904081
Operating Temperature
55℃~+200℃
Electronic Component
18mW/℃
Electronic Component
1.43min

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

NTC 3D-15 产品概述

一、产品简介

NTC 3D-15 是 RUILON(瑞隆源)系列的片式负温度系数热敏电阻(NTC),标称阻值 3Ω(25℃)。该器件为插件式封装,脚间距 P = 7.5mm,适用于对体积、安装方式有要求的低阻值限流或温度检测场合。工作温度范围宽,-55℃ ~ +200℃,可靠性高、响应速度适中,便于批量装配与维护。

二、主要电学与热学参数

  • 标称阻值(25℃):3Ω
  • B 值(25℃/50℃):2600K(用于温度-电阻换算)
  • 最大稳态电流(25℃):7A(注:实际允许电流受散热条件影响,应按工作环境和自热限制使用)
  • 耗散系数(Psi):18 mW/℃(0.018 W/℃)——器件每消耗 0.018W 功率,结温上升约 1℃
  • 热时间常数:1.43 min(约 85.8 s)——典型达到热平衡的时间量级
  • 工作温度:-55℃ ~ +200℃
  • 封装与引脚间距:插件式,P = 7.5mm

三、温度-电阻关系与示例计算

NTC 电阻随温度上升近似按指数变换,可用以下公式估算: R(T) = R25 × exp[B × (1/T - 1/T25)],温度以 K 为单位(T25 = 298.15K)。

举例:在 50℃(323.15K)时, R50 ≈ 3Ω × exp[2600 × (1/323.15 - 1/298.15)] ≈ 3Ω × 0.511 ≈ 1.53Ω。

自热示例:器件要使结温从 25℃ 上升到 50℃(ΔT = 25℃),所需耗散功率约 P = Psi × ΔT = 0.018 W/℃ × 25℃ = 0.45 W。因此在设计中必须考虑到器件自发热及周围散热条件。

注意:理论上以 3Ω、7A 连续电流计算时功耗为 I^2R = 49×3 = 147 W,此功耗远超器件通过自身散热能承受的范围,因此 7A 的“最大稳态电流”项应结合实际散热与电阻随温度变化的特性谨慎使用,通常在热平衡后器件阻值会下降且需要外部散热手段或短时脉冲使用。

四、典型应用场景

  • 充电/电源模块的浪涌限流(inrush current limiting),配合电源拓扑及散热设计使用;
  • 电子设备的温度补偿与热敏检测(经校准用于温度测量或补偿);
  • 电机驱动启动电路、冷启动浪涌抑制、变压器充磁回路防冲击;
  • 工业控制、汽车电子的温度保护与检测(在允许的温度范围内)。

五、使用与安装建议

  • 安装时确认良好散热路径:若需较大稳态电流,应加装散热片或优化 PCB/机壳散热;
  • 焊接推荐使用温控焊接,避免长时间高温直接作用于热敏体;
  • 尺寸与引脚间距便于插件与手工/波峰焊装配,注意引脚应有机械支撑以防振动损伤;
  • 为保证测量与限流精度,建议在产品设计阶段进行热仿真与实际功耗测试。

六、验收与储存

  • 验收时测量 25℃ 下电阻并与标称值比对(允许一定公差,按出厂规范);
  • 储存环境干燥、避免潮湿与强腐蚀性气体;长期存放建议封装密封,以防引脚氧化影响焊接。

七、注意事项

  • 在高电流应用中务必按整机散热能力和实际工况进行降额使用;
  • 避免器件在无适当散热条件下长期承受大功耗,以防永久损坏或阻值漂移;
  • 设计时考虑热时间常数(1.43 min),以判断响应速度与保护/控温策略。

如需进一步的阻值-温度曲线、仿真数据或样片测试报告,可提供目标工作点与电路条件,我可以协助给出更精确的计算与应用建议。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.