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RUILON SMD0805P100TF
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- RUILON SMD0805P100TF
- Type
- RUILON
- Minimum package
- 3500 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- RUILON
- Electronic Component
- SMD0805P100TF
- Electronic Component
- 1
- Electronic Component
- 1.5mm
- Package
- 0805
- Electronic Component
- Resettable Fuse
- Electronic Component
- 0.023g
- Electronic Component
- 2.2mm
- Electronic Component
- 1mm
- Electronic Component
- 1
- Electronic Component
- 300ms
- Electronic Component
- BM0238791543
- Operating Temperature
- 40℃~+85℃
- Voltage Rating(Vmax)
- 6V
- Power(Pd)
- 600mW
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
SMD0805P100TF 产品概述
一、产品简介
SMD0805P100TF 是 RUILON（瑞隆源）推出的一款 0805 封装自恢复过流保护元件（PTC 热敏自复位保险）。器件尺寸为 2.2 × 1.5 × 1.0 mm，专为空间受限的表面贴装电路设计，提供可靠的短路与过流保护，适用于便携设备、通信模块、小型电源及车载电子等场景。
二、主要参数
- 耐压（Vmax）：6 V
- 最大电流（Imax）：35 A（短时脉冲能力）
- 保持电流（Ihold）：1 A
- 跳闸电流（Itrip）：1.95 A
- 消耗功率（Pd）：600 mW
- 初始态阻值（Rmin）：40 mΩ
- 跳断后阻值（R1max）：230 mΩ
- 动作时间：300 ms（典型/触发时间取决于热环境）
- 工作温度：-40 ℃ ～ +85 ℃
- 封装：0805（2.2 × 1.5 × 1.0 mm）
- 型号：SMD0805P100TF，品牌：RUILON（瑞隆源）
三、关键特性
- 小尺寸、高密度：0805 封装便于在高密度 PCB 上布局，适配自动贴装与回流焊工艺。
- 自恢复功能：在过流状况解除后能自动恢复低阻态，减少更换成本并延长系统可用时间。
- 较高脉冲承受能力：35 A 的短时峰值能力可抵抗突发浪涌电流（需结合 PCB 散热与脉冲持续时间评估）。
- 稳定的保护阈值：1 A 保持电流与约 1.95 A 的触发电流适用于常见的低压电源保护需求。
四、典型应用
- 手机、平板等便携式终端电源保护
- USB/充电接口过流保护
- 通信设备与物联网终端的输入保护
- 车载 ECU、传感器电源保护（需按车规环境验证）
- 小型开关电源与模块保护电路
五、使用与注意事项
- 环境与散热影响：动作电流与恢复行为受环境温度、PCB 散热和邻近元件影响，设计时应考虑热耦合与走线散热条件。
- 连续工作与容许功率：Pd 为 600 mW，长时间接近功率限制会影响器件寿命，建议在额定工作点留有余量。
- 峰值电流管理：Imax 为短时能力，若系统存在多次高幅度脉冲，应评估累计热应力与寿命。
- 兼容工艺：适配标准 SMT 回流焊流程，但建议在实际工艺中验证焊接温度对器件性能的影响。
- 测试与验证：在最终产品中进行实测验证（温度、浪涌、寿命）以确保保护性能满足系统需求。
六、包装与品牌支持
SMD0805P100TF 由 RUILON（瑞隆源）生产，支持卷带式 SMT 包装，便于自动化贴装。瑞隆源提供常规的技术支持与样品验证服务，用户可根据应用提出定制化测试需求。
总结：SMD0805P100TF 在小体积下兼顾过流保护与自恢复能力，适用于多种低压电子产品。选型与布局时应结合系统热环境与脉冲特性进行综合评估，以获得最佳保护效果和长期可靠性。
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