WMSIC Electronic Components

RUILON SMD1812P050TF

ModelSMD1812P050TF
Package1812
BrandRUILON
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
RUILON SMD1812P050TF
Type
RUILON
Minimum package
1500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
RUILON
Electronic Component
SMD1812P050TF
Electronic Component
1
Electronic Component
3.41mm
Package
1812
Electronic Component
Resettable Fuse
Electronic Component
0.096g
Electronic Component
4.73mm
Electronic Component
1mm
Electronic Component
1
Electronic Component
150ms
Electronic Component
BM0246630458
Operating Temperature
40℃~+85℃
Voltage Rating(Vmax)
15V
Power(Pd)
800mW

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SMD1812P050TF 产品概述

一、产品简介

SMD1812P050TF(品牌:RUILON/瑞隆源)是一款1812封装的表面贴装自恢复保险(聚合物正温度系数热敏电阻,PPTC),用于对低电压电路(最高15V)提供过流与短路保护。器件设计用于在发生异常电流时迅速限制电流并在故障解除后自动恢复,适合消费电子、通信与工业控制等场景的短路保护需求。

二、主要参数

  • 耐压(Vmax):15 V
  • 最大电流(Imax):30 A(短时冲击能力)
  • 保持电流(Ihold):0.5 A(正常工作下不跳闸)
  • 跳闸电流(Itrip):1.0 A(在规定温度下典型动作电流)
  • 功耗(Pd):800 mW(稳态功耗/热稳定界限)
  • 初始态阻值(Rmin):150 mΩ(典型导通阻抗,影响压降)
  • 跳断后阻值(R1max):1 Ω(限制电流后的高阻态上限)
  • 动作时间:150 ms(对过流的典型响应时间)
  • 工作温度:-40 ℃ ~ +85 ℃
  • 尺寸(L×W×H):4.73 mm × 3.41 mm × 1.00 mm
  • 封装:1812,SMD

三、关键特性

  • 小尺寸SMD封装,便于自动贴片与高密度PCB布局。
  • 低初始阻抗(≥150 mΩ),在保持电流下压降小,降低系统热量与功率损耗。
  • 快速动作(约150 ms)对短路与突发过流能有效限制,跳断后阻值可达≤1 Ω,显著限制故障电流。
  • 高短时耐受电流(最高30 A),可承受开机浪涌与瞬态冲击而不损坏。
  • 宽工作温度范围,适应大多数商用与部分工业环境。

四、典型应用

  • USB、串口及外设电源保护(5 V 到 15 V 系统)。
  • 电源模块、充电器、适配器和电池管理系统的短路保护。
  • 工业控制板、通信设备的局部电路防护。
  • 家电和消费电子产品中对敏感元件的过流保护。

五、封装与安装建议

  • 采用1812标准焊盘布局,器件应尽可能靠近被保护电源输入端安装,以缩短导线和过热路径。
  • 推荐遵循厂商提供的回流焊工艺规范进行贴片,避免长时间高温循环导致性能漂移。
  • 在高电流路径上配合合适的铜箔宽度和散热设计,保证在持续工作时热量能够有效散出。

六、使用注意事项与可靠性

  • 在高温环境或靠近热源的PCB区域,应考虑保持电流和跳闸电流的温度漂移,必要时选择更高规格的器件或增加冗余保护。
  • 频繁的跳闸将使器件温度升高并可能影响寿命,建议排查根本故障原因后再依靠自恢复保险反复保护。
  • 建议在样机和量产前进行实际工作条件下的热与电应力验证,包括长期老化与温度循环测试,以确认在目标环境下的稳定性。

如需器件数据手册、典型曲线或封装建议图(PCB焊盘尺寸),可联系供应商获取详细技术资料。

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