WMSIC Electronic Components

RALEC RTT023300FTH

ModelRTT023300FTH
Package0402
BrandRALEC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

13 specifications

Core information

Product name
RALEC RTT023300FTH
Type
RALEC
Minimum package
10000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
RALEC
Electronic Component
RTT023300FTH
Electronic Component
1
Package
0402
Electronic Component
0.009g
Electronic Component
10
Electronic Component
BM0265746244
Electronic Component
Electronic Component
Electronic Component
10000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

RTT023300FTH 厚膜贴片电阻产品概述

一、产品基本信息

RTT023300FTH是RALEC(旺诠) 推出的一款小型化厚膜贴片电阻,采用0402封装(英制尺寸,对应公制1005),专为高密度、小功率电子电路设计。作为旺诠常规厚膜电阻系列的核心型号之一,该产品兼顾了精度、稳定性与成本优势,广泛适配消费电子、工业控制、汽车电子等多领域应用场景。

二、核心性能参数

该型号的关键参数明确,可满足多数中精度、小功率电路的需求:

  1. 阻值与精度:标称阻值330Ω,精度等级±1%,无需额外校准即可用于信号调理、分压等对阻值准确性要求较高的电路;
  2. 功率与电压:额定功率62.5mW,最大工作电压50V(直流/低频交流),避免过压或过功率损坏;
  3. 温度特性:温度系数(TCR)±100ppm/℃,在工作温区内阻值漂移可控,适合宽温环境稳定工作;
  4. 工作温区:-55℃至+155℃的宽温度范围,覆盖工业级、汽车级等极端环境需求。

三、封装与工艺特点

  1. 小型化封装:0402封装体积仅约1.0mm(长)×0.5mm(宽),大幅降低电路板占用面积,适配智能手机、智能穿戴等空间严苛的设备;
  2. 厚膜工艺:采用丝网印刷厚膜电阻浆料于陶瓷基底,经高温烧结形成稳定电阻层,兼具成本可控与长期阻值漂移小的优势;
  3. 表面贴装设计:端电极采用三层结构(镍/锡),兼容回流焊、波峰焊等自动化贴装工艺,焊接可靠性高;
  4. 环保合规:符合RoHS与REACH标准,不含铅、镉等有害物质,满足全球市场环保要求。

四、典型应用场景

结合参数特性,RTT023300FTH的核心应用包括:

  1. 消费电子:智能手机、平板的信号放大、分压电路,以及电源管理模块辅助电阻;
  2. 工业控制:PLC输入输出接口、传感器信号调理电路(如温度/压力传感器放大);
  3. 汽车电子:车载仪表盘背光控制、胎压监测/氧传感器接口电路,适配汽车级温区;
  4. 通信设备:路由器、交换机射频前端辅助电路、电源滤波网络,利用小体积实现高密度贴装;
  5. 医疗电子:血糖仪、血压计等小型医疗设备的信号处理电路,精度满足基本医疗要求。

五、可靠性与环境适应性

  1. 宽温稳定性:-55℃至+155℃范围内,阻值变化符合±100ppm/℃规格,高低温循环测试后性能无衰减;
  2. 耐老化性能:经1000小时+125℃额定功率测试,阻值漂移率≤0.5%;
  3. 抗机械应力:通过IEC 60068-2-6(振动)与IEC 60068-2-27(冲击)测试,适合移动设备或工业振动环境;
  4. 抗湿性:表面涂层与端电极具备抗湿性,85℃/85%RH湿热测试后无明显氧化。

六、选型与使用注意事项

  1. 功率降额:实际使用建议降额至额定功率50%以下(≤31.25mW),避免长期过负荷;
  2. 电压限制:最大工作电压50V为峰值,直流应用需注意平均电压不超额定值;
  3. 贴装工艺:回流焊峰值温度230-245℃,时间≤10秒,避免温度过高损坏;
  4. 存储条件:未开封产品存于-20℃至+30℃、湿度≤60%环境,开封后12个月内使用完毕。

该型号凭借小体积、高精度、宽温稳定等特性,成为高密度电子电路的实用选型,可有效提升产品设计的紧凑性与可靠性。

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