WMSIC Electronic Components

RALEC RTT024703FTH

ModelRTT024703FTH
Package0402
BrandRALEC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
RALEC RTT024703FTH
Type
RALEC
Minimum package
10000 圆盘

Technical parameters

Power
62.5mW
Electronic Component
Electronic Component
Electronic Component
RALEC
Electronic Component
RTT024703FTH
Electronic Component
1
Package
0402
Electronic Component
SMD Resistor
Electronic Component
±1%
Electronic Component
0.009g
Electronic Component
470kΩ
Electronic Component
10
Electronic Component
BM0265577693
Operating Temperature
55℃~+155℃
Operating Voltage
50V
Electronic Component
±100ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

RTT024703FTH 贴片厚膜电阻产品概述

一、产品基本信息

RTT024703FTH是台湾旺诠(RALEC)推出的0402封装厚膜贴片电阻,属于小型化精密电阻范畴。该型号以470kΩ为标称阻值,主打高性价比与稳定性能,广泛适配消费电子、工业控制等领域的高密度电路设计需求,是旺诠厚膜电阻产品线中的经典型号之一。

二、核心性能参数解析

  1. 阻值与精度
    标称阻值为470kΩ,精度等级达±1%,可满足多数精密信号调理、分压电路的误差要求,避免因阻值偏差导致的信号偏移或控制精度下降。对于对精度要求更高的场景,可结合实际电路需求做二次筛选,但常规应用无需额外处理。

  2. 功率与电压额定值
    额定功率为62.5mW(即1/16W),最大工作电压50V。需注意电路中实际功率需满足P=I²R≤62.5mW,或V≤50V(取两者较小值)。例如,当工作电压为50V时,最大允许电流约为106μA,实际应用中建议留有余量(如降额至80%功率),以延长产品寿命。

  3. 温度特性与工作范围
    温度系数(TCR)为±100ppm/℃,即在-55℃至+155℃的宽温范围内,每变化1℃,阻值变化约0.01%。该特性确保产品在极端温度环境下(如工业户外、车载高温区)仍能保持稳定性能,避免因温度波动导致的电路参数漂移。

  4. 环境适应性
    工作温度范围覆盖-55℃~+155℃,符合工业级宽温要求;同时产品采用厚膜工艺,具备较好的抗冲击、抗振动性能,可应对量产中的SMT焊接应力及长期使用中的环境振动。

三、封装与工艺优势

RTT024703FTH采用0402英制封装(对应公制1005,尺寸为长1.0mm×宽0.5mm×高0.35mm),是目前小型化电路中最常用的贴片封装之一。该封装的优势包括:

  • 适配自动化SMT生产,提高电路组装效率;
  • 适合高密度PCB设计,可有效缩小产品体积;
  • 厚膜工艺平衡了成本与性能:相比薄膜电阻,成本更低;相比碳膜电阻,稳定性、温度特性更优,耐高压性能更好。

四、典型应用场景

基于其小体积、宽温、稳定性能的特点,RTT024703FTH广泛应用于以下领域:

  1. 消费电子:智能手机、平板、智能穿戴设备的信号滤波、分压电路(如电池管理、传感器接口);
  2. 工业控制:PLC模块、传感器信号放大电路、小型仪器仪表的校准电路;
  3. 汽车电子:车载中控系统、胎压监测模块、车灯控制电路(需确认符合汽车级认证,其温度范围可覆盖部分车载高温场景);
  4. 通信设备:小型基站、路由器的偏置电路、阻抗匹配网络;
  5. 医疗设备:小型监护仪、血糖仪的信号采集电路(需结合医疗级认证要求,但精度与温度特性支持基础医疗应用)。

五、品牌与可靠性说明

旺诠(RALEC)作为全球知名的被动元件制造商,其厚膜电阻产品线具备成熟的生产工艺与严格的质量管控:

  • 产品符合RoHS、REACH等环保标准,无铅无卤;
  • 厚膜工艺的长期可靠性:经老化测试后阻值漂移率低(通常≤0.5%/1000小时);
  • 量产稳定性:旺诠的自动化生产能力确保批量供货的一致性,适合大规模量产需求。

六、选型与使用注意事项

  1. 功率降额:实际使用功率建议不超过额定功率的80%(即≤50mW),避免长期过载导致阻值老化;
  2. 电压限制:电路中工作电压不得超过50V,防止绝缘击穿;
  3. 温度范围:确保工作环境温度在-55℃~+155℃内,超出范围会导致阻值漂移或性能失效;
  4. 封装匹配:PCB焊盘需匹配0402封装尺寸(建议焊盘长1.21.3mm,宽0.60.7mm),避免虚焊或焊接不良;
  5. 精度验证:对于高精度要求的电路(如医疗、计量设备),可对批量产品做抽样测试,确认实际精度符合±1%要求。

该型号凭借小体积、宽温、稳定可靠的特性,成为众多小型化电路设计的优选电阻之一,可满足不同领域的基础精密电阻需求。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.