WMSIC Electronic Components

RENESAS ISL83072EIBZA-T ISL83072EIBZA

ModelISL83072EIBZA-T
PackageSOIC-8
BrandRENESAS
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 22+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
RENESAS ISL83072EIBZA-T
Type
RENESAS
Minimum package
2500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
RENESAS
Electronic Component
ISL83072EIBZA-T
Electronic Component
1
Package
SOIC-8
Type
Transceiver
Electronic Component
RS-485 / RS-422IC
Electronic Component
0.106g
Electronic Component
256
Electronic Component
1
Electronic Component
BM0257394536
Operating Temperature
40℃~+85℃
Operating Voltage
3V~3.6V
Receiver
1
Data
250Kbps
Static Current
510uA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

ISL83072EIBZA-T 产品概述

ISL83072EIBZA-T 是瑞萨(RENESAS)面向工业现场总线与差分通信应用的半收发器器件,集成 1 路驱动器与 1 路接收器,支持 RS-422 与 RS-485 差分接口。器件工作电压为 3.0V 至 3.6V,数据速率可达 250 kbps,适配常用的 3.3V 嵌入式系统并满足工业级温度与静电可靠性要求。

一、主要特点

  • 半收发器结构:1 驱动器、1 接收器,适合点对点或总线拓扑的差分通信。
  • 支持标准:面向 RS-422/RS-485 差分通信应用(半双工或特定点对点),兼容大多数工业协议。
  • 电源与功耗:工作电压 3.0–3.6V(典型 3.3V);静态电流仅 510 µA,利于低功耗或电池供电系统。
  • 速率与节点:最高数据速率 250 kbps,支持多节点网络(标称节点数 256)。
  • 环境与可靠性:工作温度范围 -40 ℃ 至 +85 ℃,器件静电保护 ±15 kV,满足恶劣工业场景需求。
  • 封装:SOIC-8,便于 PCB 布局与批量生产。

二、关键参数(概要)

  • 类型:半收发器(1 驱动 / 1 接收)
  • 接口标准:RS-422 / RS-485(差分)
  • 工作电压:3.0V ~ 3.6V
  • 数据速率:最大 250 kbps
  • 支持节点数:256(总线拓扑下的节点容量指标)
  • 静态电流:510 µA
  • 工作温度:-40 ℃ ~ +85 ℃
  • 静电保护:±15 kV
  • 封装:SOIC-8

三、典型应用场景

  • 工业自动化现场总线(如工业控制器与远程 I/O)
  • 楼宇自控与能耗监测系统(低功耗差分通信)
  • 电力与配电监测、仪表读数采集
  • 串行总线扩展、长距离差分通信链路
  • 嵌入式设备需要与 RS-485/RS-422 总线互联的场合

四、硬件设计注意事项

  • 总线终端:在总线两端宜采用合适阻值的终端电阻(常见 120 Ω)以减少反射;若链路较短或节点较少可按实际信号完整性调整。
  • 偏置与容错:在无驱动器输出时,应通过偏置电阻(上拉/下拉)保证差分线具有确定的电平(fail-safe);若器件未内置偏置,需在外部实现。
  • PCB 布局:差分线走线要保持长度一致、靠近并成对布线,减少串扰与共模干扰。为提高抗干扰能力,建议屏蔽接地并远离高频干扰源。
  • ESD 与浪涌:器件自带 ±15 kV 静电耐受能力,但在工业现场仍推荐采取 TVS 管、浪涌抑制与适当防护措施以延长系统寿命。
  • 供电与滤波:为保证通信可靠性,电源端建议加去耦电容并考虑上电/断电顺序对总线的影响。

五、封装与选型建议

  • SOIC-8 封装便于通过波峰或回流焊接入板,适用于批量生产与维修更换。
  • 在选型时,关注系统是否需要更高速率或更强抗干扰能力;若需更高带宽或更低延迟,考虑更高速的差分收发器。
  • 若系统节点数或线缆特性特殊,请结合实际测试结果调整终端、偏置及线缆阻抗以保障通信稳定性。

六、总结

ISL83072EIBZA-T 为面向工业级差分通信的半收发器,凭借 3.0–3.6V 的低电压供电、510 µA 的低静态电流、250 kbps 的可靠速率以及 ±15 kV 的静电防护,适合需要低功耗、耐环境干扰且兼容 RS-422/RS-485 总线的嵌入式与工业应用。在实际设计中注意总线终端、偏置与布局等细节,可充分发挥该器件在现场通信中的稳定性与可靠性。

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