Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
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Technical data
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R5F10268ASP#55 是来自瑞萨电子(Renesas Electronics)的一款高性能16位单片机,属于其 RL78/G12 系列。这款单片机以其出色的性能和灵活的连接选项而被广泛应用于各种嵌入式系统的设计中,包括家电、工业控制、智能仪器以及消费电子等领域。
R5F10268ASP#55 基于 RL78 核心处理器,具有高效能、低功耗的特点,工作频率最高可达 24MHz,能够满足大多数应用对处理速度的需求。此外,这款单片机的工作电压范围为 1.8V 至 5.5V,使其能够在多种电源条件下稳定运行,适应便携式设备和低功耗应用的需求。
在存储方面,R5F10268ASP#55 集成了 8KB 的程序存储容量(闪存类型),适合存储复杂的应用程序和算法。同时,该单片机还配备了 2KB 的 EEPROM 存储,用于非易失性数据的存储以及状态信息的持续保存。其 768B 的 RAM 为实时数据处理提供了足够的存储空间,确保系统能高效地运行各种功能。
为了增强系统的连接能力,R5F10268ASP#55 支持多种通信协议,包括 CSI(串行接口)、I²C(串行外设接口)以及 UART/USART(异步串行通讯)。这使得它可以轻松与其他外部设备和传感器进行通讯和数据交互,便于构建多功能的系统。
此外,该单片机还集成了一系列丰富的外设功能,包括:
R5F10268ASP#55 采用 LSSOP-20 厚度为 0.173"(4.4mm)的封装,便于表面贴装,适合于紧凑型设计需求。这一封装设计不仅节省了空间,还可以提高生产效率,便于大规模生产和装配。
该单片机的工作温度范围为 -40°C 至 85°C,使其适用于各种极端环境,增强了产品在工业以及严苛条件下的可靠性和稳定性。这为电子工程师提供了更多的设计灵活性,能够在复杂和恶劣的环境中正常工作。
得益于其丰富的功能和灵活的接口,R5F10268ASP#55 被广泛应用于以下领域:
R5F10268ASP#55 是一款性能卓越、功能全面的16位单片机,适用于多种应用场景。凭借其高效的处理能力、丰富的外设接口和良好的环境适应性,能够满足各种产品在设计上的需求,为电子设计工程师提供了强有力的支持。
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Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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