Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
RENESAS UPD720210K8-BAF-A UPD720210K8
Configuration
1 options
Configuration
22+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- RENESAS UPD720210K8-BAF-A
- Type
- RENESAS
- Minimum package
- 1300 托盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- RENESAS
- Electronic Component
- UPD720210K8-BAF-A
- Electronic Component
- 1
- Package
- QFN-76-EP(9x9)
- Type
- Electronic Component
- Electronic Component
- USB Hub
- Electronic Component
- 1.032g
- Electronic Component
- 1
- Features
- Regulator; Power Supply Switch; Power Supply Switch; positions;; BC1.2
- Electronic Component
- BM0257253962
- Operating Temperature
- 0℃~+70℃
- Operating Voltage
- 1.05V；3.3V；5V
- Data
- 5Gbps
- USB
- USB 3.0
- Memory Interface
- SPI
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
UPD720210K8-BAF-A 产品概述
一、产品简介
uPD720210K8-BAF-A 是瑞萨（Renesas）推出的一款高性能 USB 集线器控制器芯片，面向 USB 3.0（SuperSpeed）集线器应用。器件封装为 QFN-76（9×9 mm，带散热焊盘），提供 SPI 存储器接口用于固件/描述符存储和配置，适合嵌入式外设扩展、扩展坞与消费类外置集线器等产品线。
二、主要参数
- 器件类型：集线器控制器（USB hub controller）
- USB 协议版本：USB 3.0（向下兼容 USB 2.0/1.1）
- 最大数据速率：SuperSpeed 5 Gbps
- 工作电压：核心 1.05 V，IO/逻辑 3.3 V，VBUS 5 V
- 工作温度：0 ℃ ~ +70 ℃（适用一般消费/工业室温场景）
- 外部存储接口：SPI（用于外部闪存，保存配置/描述符/固件）
- 封装：QFN-76-EP（9×9 mm，带热焊盘）
- 品牌：RENESAS（瑞萨）
三、功能与特性
该器件面向 USB 3.0 集线器实现，支持 SuperSpeed 通信并兼容低速/全速/高速 USB 设备。通常集成链路管理和 PHY 接口（需结合具体数据手册确认），并提供通过 SPI 外接闪存以实现设备描述符与固件的灵活定制。器件支持常见的电源与端口管理策略（如 VBUS 控制与端口使能），便于在多端口集线器或扩展坞方案中实现对外设的电源和枚举管理。芯片稳定的高速特性可保证外接存储、摄像头和其他大带宽外设的传输性能。
四、主要应用场景
- 外置 USB 3.0 集线器与多口扩展坞
- 笔记本/桌面扩展接口板与显示器带 USB 集线功能的面板
- 一体机与工控主板的 USB 分发与管理
- 消费类外设（外置硬盘盒、高清视频采集器等）的带宽分配与端口控制
五、封装与 PCB 设计要点
采用 QFN-76（9×9）封装，底部带散热焊盘（EP），建议在 PCB 布局时提供良好散热与接地回流。高速 USB 差分对需严格做阻抗控制与对称布线，靠近器件处保留合适差分对长度匹配。为 1.05 V、3.3 V 与 5 V 电源分别设计去耦电容与上电顺序，确保核心与 IO 稳定。USB VBUS 线应考虑电流承载能力与热耗，外部应配合过流检测、限流与 ESD/浪涌保护器件以提升系统可靠性。SPI 闪存布局应靠近芯片，缩短时钟与数据线长度以保证编程与启动时的可靠性。
六、选型与工程注意
在选型时确认所需的端口数与系统电源预算，评估是否需要外部开关或电源控制芯片配合 VBUS 管理；根据产品定位选择合适容量与速度的 SPI 闪存以存放固件与描述符；参考瑞萨提供的数据手册与参考设计，利用评估板进行功能验证与兼容性测试。注意器件的工作温度范围为 0~70 ℃，若应用于更苛刻环境需考虑额外的温度方案或选用更高等级器件。
如需后续提供规格书要点拆解、参考原理图建议或 PCB 布线检查清单，可告诉我您的具体设计与应用场景，我将提供针对性的工程建议。
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