WMSIC Electronic Components

RENESAS ISL29035IROZ-T7 ISL29035IROZ

ModelISL29035IROZ-T7
PackageDFN-6(1.5x1.5)
BrandRENESAS
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 21+

Available for RFQ

Technical data

Product details

17 specifications

Core information

Product name
RENESAS ISL29035IROZ-T7
Type
DFN-6(1.5X1.5)
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
RENESAS
Electronic Component
ISL29035IROZ-T7
Electronic Component
1
Package
DFN-6(1.5x1.5)
Electronic Component
Ambient Light Sensor
Electronic Component
0.015g
Electronic Component
1
Features
Low Power
Electronic Component
BM0265144324
Operating Temperature
40℃~+85℃
Operating Voltage
2.25V~3.63V
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

ISL29035IROZ-T7 产品概述

一、产品简介

ISL29035IROZ-T7 是 RENESAS(瑞萨)旗下的小型环境光传感器,封装为 DFN-6 (1.5 × 1.5 mm),适合对尺寸和功耗有严格要求的便携式与嵌入式应用。器件可在 2.25 V 至 3.63 V 电源电压下稳定工作,工作温度范围为 -40 ℃ 到 +85 ℃,适应广泛的工业与消费类环境。

二、主要特性

  • 小尺寸低剖面:DFN-6(1.5×1.5) 便于紧凑型 PCB 布局与自动化贴装。
  • 低功耗设计:适合电池供电设备的常亮/周期采样方案,延长续航。
  • 宽动态响应:覆盖暗环境到强光场景(室内至户外)的光强检测需求。
  • 光学匹配:对人眼视觉响应(光谱敏感性)经过优化,便于用来做屏幕背光与亮度控制。
  • 常见数字接口支持(如 I²C/SMBus 等):便于与 MCU/应用处理器集成(具体接口与寄存器请参照原厂数据手册)。

三、典型应用场景

  • 手机、平板与笔记本的自动亮度/背光控制
  • 可穿戴设备与智能手环的环境光检测
  • 智能家居与物联网终端的光照监测与节能控制
  • 工业控制面板与车载仪表的环境光自适应

四、设计与布局建议

  • 电源旁放置 0.1 μF 陶瓷去耦电容,并靠近 VDD 引脚,以保证供电稳定。
  • 若使用 I²C 总线,SDA/SCL 侧应配置合适的上拉电阻,避免上拉过大影响通信速度或过小增加功耗。
  • 光学窗口:传感器应面向待测场景,避免正对强烈反射或局部遮挡;如需镜头或光学滤光片,留意外加元件对频谱响应的影响。
  • 布局上应远离高热源与强光源(如 LED 发光二极管近距直射),以减少测量误差。地线与回流路径应紧凑,降低噪声耦合。

五、使用与校准建议

  • 上电复位与初始化:首次上电后按数据手册初始化寄存器与工作模式,必要时进行软件滤波与去噪处理。
  • 校准:在产品标定阶段建议以已知标准光源对传感器做一次线性/非线性校准,以提高读数精度。
  • 采样策略:根据功耗预算选择连续测量或定时唤醒测量;对动态场景可采用滑动窗口平均减小闪烁误差。
  • 温度漂移:如需高精度读数,应考虑温度补偿策略或在固件中加入温度相关修正。

六、注意事项与资料获取

  • 本概述给出器件的关键特性与工程应用建议,但不替代原厂数据手册。为确保正确的脚位连接、寄存器定义、通信时序与光学响应曲线,请务必参考 RENESAS 官方 Datasheet 与器件应用手册。
  • 在批量设计前,建议申请样片并在目标应用环境下做完整的功能与可靠性验证。

如果需要,我可以帮您整理该器件的推荐外围电路模板、常用寄存器初始化序列或在典型 MCU(如 STM32/ESP32)上的驱动代码示例。

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