WMSIC Electronic Components

Silergy SM80593LDQC

ModelSM80593LDQC
PackageDFN-6(1.5x1.5)
BrandSILERGY
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 24+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
silergy SM80593LDQC
Type
SILERGY
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
SILERGY
Electronic Component
SM80593LDQC
Electronic Component
1
Package
DFN-6(1.5x1.5)
Electronic Component
DC-DC Power Supply IC
Electronic Component
0.036g
Electronic Component
1
Features
Output
Type
Electronic Component
Synchronous
Electronic Component
Electronic Component
BM0265638757
Operating Temperature
40℃~+85℃
Operating Voltage
2.5V~5.5V
Switching Frequency
1MHz
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

矽力杰SM80593LDQC DC-DC降压电源芯片产品概述

矽力杰(Silergy)作为国内电源管理芯片领域的领先厂商,其推出的SM80593LDQC是一款针对便携设备、低功耗IoT终端等场景优化的同步降压DC-DC电源芯片。该芯片以超小封装、高集成度、低静态功耗为核心特点,精准匹配中等功率负载下的高效供电需求,是便携类终端的优选电源方案。

一、产品定位与品牌背景

矽力杰深耕电源管理领域十余年,产品覆盖从低功耗到高功率的全系列DC-DC、AC-DC及线性稳压器。SM80593LDQC属于其便携设备专用降压芯片序列,聚焦于对体积、待机功耗要求严苛的应用场景——例如TWS耳机充电盒、智能穿戴设备等,旨在通过高集成度设计简化客户PCB布局,同时兼顾能效与成本控制。

二、关键性能参数深度解析

SM80593LDQC的参数设计精准贴合便携场景的核心痛点,关键参数如下:

  1. 输入输出范围:工作电压覆盖2.5V~5.5V,完全兼容单节锂离电池(3.7V典型电压)、USB 5V供电及低电压电池场景;最大输出电流3A,可满足中等功率负载(如小型蓝牙音箱、带屏智能手环)的供电需求。
  2. 拓扑与整流:采用同步降压拓扑,内置同步整流MOS管,无需外置续流二极管,既简化BOM(物料清单),又降低了开关损耗,提升转换效率。
  3. 开关频率:固定1MHz高频开关,处于电源芯片的“高效高频段”——高频设计可大幅减小外围电感、电容的体积(电感值可降低至1~2.2μH),完美适配小封装PCB布局。
  4. 静态功耗:典型静态电流仅55μA,在同类3A降压芯片中属于低功耗水平,能够显著延长电池供电设备的待机时间(例如TWS充电盒待机可达数月)。
  5. 输出特性:输出电压可调(通过外部电阻分压设置),用户可灵活配置1.0V~V_IN的输出电压,适配不同负载的电压需求(如MCU的3.3V、传感器的1.8V)。
  6. 集成度:内置功率MOS管,无需外置N-MOS及续流管,进一步压缩PCB面积与BOM成本,降低设计复杂度。

三、封装特点与物理尺寸

SM80593LDQC采用DFN-6封装(1.5mm×1.5mm),这是一款超小型无引脚封装,具备三大核心优势:

  • 体积极致:1.5×1.5mm的封装尺寸仅为常规SOT-23封装的1/3左右,非常适合空间极度紧张的便携设备(如TWS充电盒内部空间仅数平方厘米)。
  • 散热高效:DFN封装通过焊盘直接散热至PCB,相比传统封装(如SOT),散热效率提升约30%,可满足3A输出时的功率耗散需求,避免芯片过热。
  • 布线简单:6引脚设计简化了PCB布线,减少了寄生参数对电路性能的影响,提升电路稳定性。

四、设计优势与典型应用场景

核心设计优势

  1. 高集成度降本:内置同步整流MOS与功率管,无需外置续流二极管、MOS管,BOM成本降低约20%;
  2. 小体积适配紧凑空间:1MHz高频+DFN小封装,外围元件(电感、电容)可选用0402甚至0201封装,PCB占板面积可控制在10mm²以内;
  3. 低静态功耗延长待机:55μA静态电流使设备待机时几乎不消耗电池电量,适合长期待机的IoT传感器、TWS充电盒等;
  4. 宽输入覆盖多场景:2.5V~5.5V输入兼容单节锂电池、USB 5V、3.3V线性电源等多种供电方式。

典型应用场景

  • TWS无线耳机充电盒:适配3.7V锂电池输入,输出5V/1A给耳机充电,待机功耗低;
  • 智能穿戴设备:智能手环/手表的核心MCU、传感器供电(3.3V/1.5A),小封装不影响设备外观;
  • 小型IoT传感器节点:如温湿度传感器、运动传感器的供电,满足长期待机需求;
  • 便携式医疗设备:血糖监测仪、小型血氧仪的低功耗供电;
  • 蓝牙音箱/耳机:3A输出满足小型蓝牙音箱的功率需求。

五、总结

SM80593LDQC是矽力杰针对便携设备与低功耗IoT场景推出的高性价比同步降压芯片,以“超小封装、低静态功耗、高集成度”为核心竞争力,完美平衡了体积、能效与成本。其参数覆盖了中等功率负载的主流需求,适合对空间、待机时间要求严苛的终端产品设计,是同类应用中的优选电源方案之一。

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