WMSIC Electronic Components

RENESAS AT45DB641E-MHN-T AT45DB641E

ModelAT45DB641E-MHN-T
PackageUDFN-8
BrandRENESAS
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
RENESAS AT45DB641E-MHN-T
Type
UDFN-8
Minimum package
6000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
RENESAS
Electronic Component
AT45DB641E-MHN-T
Electronic Component
1
Package
UDFN-8
Electronic Component
NOR FLASH
Electronic Component
0.11g
Electronic Component
1
Electronic Component
BM0264684465
Electronic Component
64Mbit
Operating Voltage
1.7V~3.6V
Current
7mA
Interface Type
SPI
Electronic Component
100000
Clock Frequency(fc)
85MHz
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

AT45DB641E-MHN-T 产品概述

一、产品简介

AT45DB641E-MHN-T 为 RENESAS(瑞萨)系列串行 NOR 闪存器件,存储容量 64 Mbit(8 MByte),通过 SPI 接口提供非易失性数据存储。器件采用 UDFN-8 小封装,适合对空间、功耗和成本有严格要求的嵌入式应用。该器件工作电压范围宽(1.7V ~ 3.6V),适配单电源 1.8V 与 3.3V 系统。

二、核心参数

  • 接口类型:SPI(串行外设接口)
  • 存储容量:64 Mbit(8 MByte)
  • 最高时钟频率(fc):85 MHz(设计时请确保总线时序满足器件数据手册要求)
  • 工作电压:1.7 V ~ 3.6 V
  • 待机电流:7 mA(请在具体模式下参照数据手册获取典型/最大值)
  • 擦写寿命:100,000 次(典型单元擦写循环)
  • 数据保持(TDR):20 年
  • 封装:UDFN-8(小体积、适合高密度 PCB 布局)

三、封装与机械特性

UDFN-8 封装为扁平无引脚封装,底部有散热/接地焊盘,利于热量和地平面的传导。该封装适合对高度受限的模块化设计,但对焊接工艺要求较高,需注意回流温度曲线与焊盘设计,以确保焊点可靠性。

四、可靠性与寿命

器件支持 100k 次擦写循环,数据在典型环境下可保存 20 年,适合长期固件、参数与配置数据存储。实际系统寿命与使用模式、写入分布(磨损均衡)及工作温度有关,建议在需要高写入寿命的场景采用磨损均衡与错误校验策略。

五、典型应用场景

  • 嵌入式控制器固件存储(Boot ROM、固件更新)
  • 消费电子的配置与参数保存
  • 工业设备日志、校准数据保存
  • 物联网设备与传感器节点的非易失性数据存储

六、设计与使用建议

  • 电源与去耦:在 VCC 引脚附近放置合适数值的陶瓷去耦电容(例如 0.1 µF 与 1 µF 并联),并保证地平面连续,减少开关噪声。
  • SPI 总线速率:器件最高支持 85 MHz 时钟,系统设计时应考虑 PCB 串扰、线长与驱动能力,如需长线传输建议降低速率或添加阻抗匹配。
  • 引脚与功能:器件常含片选(CS)、时钟(SCLK)、数据输入/输出(MOSI/MISO)及其他控制引脚,具体接法与命令集请参照官方数据手册。
  • 写入策略:为延长寿命,应尽量合并写操作、减少不必要擦写,并在系统中实现擦写计数、磨损均衡和校验(CRC)机制。
  • 热管理与焊接:UDFN-8 底部焊盘须与 PCB 焊盘良好焊接,回流工艺需按推荐曲线执行,避免因焊接不良影响器件可靠性。
  • ESD 与浪涌保护:在易受静电或浪涌影响的应用中,建议在输入端增加合适的 TVS 或串联电阻,保护器件 IO。

七、总结

AT45DB641E-MHN-T 提供了 64 Mbit 的 SPI 串行 NOR 闪存解决方案,兼顾容量、低电压兼容性与小型封装,适用于固件存储与长期数据保存场景。设计时应遵循电源去耦、信号完整性与擦写管理等良好实践,并参考器件数据手册获取完整的时序、命令与电气特性,以确保系统长期稳定可靠运行。若需详细引脚定义、时序图或典型电路,请参考 RENESAS 官方资料或联系供应商技术支持。

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