WMSIC Electronic Components

RENESAS 5PB1102CMGI8

Model5PB1102CMGI8
Package8-DFN(2x2)
BrandRENESAS
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Electronic Component

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
RENESAS 5PB1102CMGI8
Type
RENESAS
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
RENESAS
Electronic Component
5PB1102CMGI8
Electronic Component
1
Package
8-DFN(2x2)
Electronic Component
Clock Buffer / Driver / Distributor
Electronic Component
0.48g
Electronic Component
1
Features
Output /; and; / Isolated Driver
Electronic Component
BM0264858956
Operating Temperature
40℃~+85℃
Operating Voltage
1.71V~3.465V
Channel Count
1
Output Channel Count
2
Output Frequency
200MHz
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

5PB1102CMGI8 产品概述

一、产品简介

5PB1102CMGI8 是瑞萨(RENESAS)推出的一款高性能时钟扇出缓冲器(1:2 分配器),面向需要将单一路时钟源稳定分配到两个下游设备的应用场景。器件支持最高 200 MHz 的输出频率,工作电压范围宽(1.71 V 至 3.465 V),并在工业级温度范围内可靠工作(-40 ℃ 至 +85 ℃)。该器件集成输出使能/关断控制、内部阻抗/偏置网络以及隔离驱动功能,适合对抖动和信号完整性有较高要求的系统。

二、主要特点

  • 单路输入,双路输出(1:2 扇出)设计,便于将主时钟分发到多路逻辑或器件。
  • 最大输出频率:200 MHz,覆盖常见的系统时钟与低中速数据链路。
  • 工作电压:1.71 V ~ 3.465 V,兼容 1.8 V、2.5 V、3.3 V 等多种电源域。
  • 工作温度范围:-40 ℃ ~ +85 ℃,适用于工业与商用环境。
  • 输出使能/关断(OE)功能,可通过控制引脚快速使能或三态关闭输出,便于系统级管理与节能。
  • 内部终端与偏置网络,简化外部匹配与偏置设计,提高信号完整性。
  • 多路扇出/隔离驱动,提供必需的驱动能力以驱动多个负载或隔离敏感下游电路。
  • 紧凑封装:8 引脚 DFN(2.0 mm x 2.0 mm),节省 PCB 面积并具备良好热性能。

三、关键规格

  • 输入通道数:1
  • 输出通道数:2
  • 最大输出频率:200 MHz
  • 电源电压:1.71 V ~ 3.465 V
  • 工作温度:-40 ℃ ~ +85 ℃
  • 功能特性:输出使能/关断、内部终端与偏置网络、多路扇出/隔离驱动
  • 封装形式:8 引脚 DFN(2 x 2 mm),带裸露散热焊盘

(注:对于具体的时序参数、输出摆幅、上升/下降时间、输出驱动能力以及抖动指标,请参照瑞萨官方数据手册以获得详尽参数。)

四、封装与引脚说明

5PB1102CMGI8 采用 8 引脚 DFN 小封装(2.0 mm × 2.0 mm),底部通常带有裸露散热焊盘(EP),以改善热散逸和机械固定。该封装利于高密度板上布置,适合对空间敏感的消费类、通信或嵌入式设计。使用时建议牢固焊接裸露焊盘以保证良好的热与电气性能。

常见注意项:

  • 给电源引脚和接地引脚提供充分去耦(近旁放置陶瓷电容),以抑制电源噪声对时钟性能的影响。
  • 若器件内置偏置/终端网络仍需外部阻抗匹配,应按数据手册推荐的网络配置进行调整。

五、典型应用场景

  • 主时钟在系统内部向多个子系统或外设分配(FPGA、微控制器、ADC/DAC 等)。
  • 时序隔离:在需要将单一时钟源隔离为两个独立驱动域以防止负载互相影响时使用。
  • 通信与网络设备中对中频时钟分配(交换机、路由器、收发器前端)。
  • 测试测量设备、工业控制与汽车电子(需符合工作温度范围要求的场合)。
  • 需要低功耗使能控制的系统中,通过 OE 引脚实现输出按需开启或关断。

六、PCB 布局与使用建议

  • 电源去耦:尽量在电源引脚与器件之间放置 0.1 μF 至 1 μF 的陶瓷去耦电容,并靠近器件放置,以减少回路电感。
  • 地平面:在芯片下面和周边区域保留连续接地平面,以降低地弹与 EMI。裸露散热焊盘应通过多点过孔与下层接地平面连接以优化热性能。
  • 信号线:时钟输入与输出走线应尽量短且保持恒定阻抗(例如 50 Ω),避免 90° 弯角,并使用差分或单端屏蔽手段(视信号标准而定)。
  • 终端匹配:若外部负载或连接线会引入反射,保留匹配电阻位置以便根据实际条件进行外部终端匹配。
  • OE 控制:若需要通过 MCU 或逻辑控制 OE,请确保控制信号的电平与器件工作电压域兼容,或通过电平移位电路转换。

七、订购与合规性

5PB1102CMGI8 为瑞萨器件系列中的标准零件,常见以卷装或托盘形式供应。具体订购信息、最小包装量、交期和合规认证(如 RoHS/无铅)请参考瑞萨官方产品目录或经销商报价页面。对于关键系统设计,建议向瑞萨索取数据手册和应用说明,或与技术支持联系以获取最佳实践与评估样片。

总结:5PB1102CMGI8 是一款小体积、功能完备的 1:2 时钟扇出缓冲器,适用于需高可靠性、低抖动分配与灵活电源兼容性的场景。合理的 PCB 布局与电源管理将有助于发挥其最佳性能。

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