WMSIC Electronic Components

RENESAS R7FA4M2AC3CFM#AA0 R7FA4M2AC3CFM

ModelR7FA4M2AC3CFM#AA0
Package64-LQFP
BrandRENESAS
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 22+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
RENESAS R7FA4M2AC3CFM#AA0
Type
RENESAS
Unit
Electronic Component
Minimum package
160 托盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
RENESAS
Electronic Component
R7FA4M2AC3CFM#AA0
Electronic Component
1
Package
64-LQFP
Electronic Component
MCU(MCU / MPU / SOC)
Electronic Component
0g
CPU
32 Bit
CPU
ARM Cortex-M33
Electronic Component
1
Electronic Component
BM0264483413
CPU
100MHz
Electronic Component
Electronic Component
Electronic Component
160
Electronic Component
384KB

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

R7FA4M2AC3CFM#AA0 产品概述

R7FA4M2AC3CFM#AA0 是瑞萨(RENESAS)推出的一款高性价比 32 位微控制器,基于 ARM Cortex‑M33 内核,主频最高 100 MHz。该器件在计算性能、片上资源和工业级可靠性之间取得了良好平衡,适合对实时性、模拟混合信号处理和稳定性有要求的嵌入式应用。

一、核心与性能

芯片采用 ARM Cortex‑M33 内核(32 bit),最高主频 100 MHz,具备较强的整数运算能力和低中等实时控制性能。Cortex‑M33 架构对安全扩展(如 TrustZone)和 DSP 指令的支持,为需要隔离或加密保护的方案提供硬件基础(具体安全功能以器件实际数据手册为准)。

二、存储资源

片内 Flash 程序存储容量为 384 KB(FLASH),能够满足中等复杂度应用的固件与引导需求;RAM 为 128 KB,支持运行时数据与任务堆栈;此外内置 8 KB EEPROM,适用于存储校准参数、用户配置或少量持久数据,减少外部存储器依赖。

三、外设与 I/O

器件提供 44 个通用 I/O(I/O 数量 44),可灵活配置为 GPIO、外设复用接口等,适配多路传感器、控制信号和人机交互接口。常用调试与编程接口(如 SWD)可用于固件下载与调试(具体信号管脚请参考封装引脚图)。

四、模数与数模转换

内置 12‑bit ADC 与 12‑bit DAC,适合精度在 12 位范围内的传感器读数采集与模拟输出控制(如模拟阀门位置、音频或参考电压输出),为数据采集与控制环路提供片上解决方案,减少外部 ADC/DAC 成本。

五、时钟与电源

采用内置振荡器,可简化系统时钟设计并快速启动。工作电压范围 2.7 V ~ 3.6 V,兼顾常见单电源系统与电池供电需求;器件在工业级温度范围内工作,适合苛刻环境应用。

六、封装与温度特性

封装为 64‑LQFP(10×10 mm),引脚数与布局便于原型设计与量产板载实现。工作温度范围为 -40 ℃ 至 +105 ℃,满足工业级温度要求,适用于室外或高温环境下的长期运行。

七、典型应用场景

  • 工业控制与自动化:传感器采集、现场控制器、I/O 扩展单元。
  • 数据采集与处理:多路模拟输入、信号预处理与本地算法。
  • 人机界面与仪表:键盘、显示驱动、音频提示(结合 DAC)。
  • 智能传感节点:需本地计算、存储及可靠通信的嵌入式终端。

八、设计与开发建议

  • 电源布线应保证稳压与去耦,关键电源引脚旁放置陶瓷电容以抑制瞬态噪声。
  • 模拟通道(ADC/DAC)应采用单独的参考与滤波设计,保证采样精度。
  • 若使用内部振荡器进行精确时序或通信,应评估频率精度,必要时采用外部晶体/振荡器。
  • 推荐使用瑞萨官方开发工具链与示例代码(如 e² studio / 供应方软件包),以加快产品开发与调试。

九、总结

R7FA4M2AC3CFM#AA0 以 ARM Cortex‑M33 为核心,提供 384 KB Flash、128 KB RAM 和丰富的片上外设(含 12‑bit ADC/DAC、44 路 I/O),并在工业温度与 2.7–3.6 V 供电范围内运行,适合需要可靠性、模拟处理能力和适度计算性能的嵌入式系统。对希望在现有硬件平台上实现高集成度和降低 BOM 成本的项目,是一种值得考虑的 MCU 选型。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.