WMSIC Electronic Components

RENESAS PS8101-F3-AX PS8101

ModelPS8101-F3-AX
PackageSOP-5-175mil
BrandRENESAS
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
RENESAS PS8101-F3-AX
Type
SOP-5-175MIL
Minimum package
2500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
RENESAS
Electronic Component
PS8101-F3-AX
Electronic Component
1
Package
SOP-5-175mil
Electronic Component
Logic Output Optocoupler
Electronic Component
0.202g
Electronic Component
1
Channel Count
1
CMTI(kV/us)
15kV/us
Electronic Component
1Mbit/s
Electronic Component
BM0257222493
Operating Temperature
55℃~+100℃
Operating Voltage
4.5V~35V
Type
DC
Output Voltage
35V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

PS8101-F3-AX 产品概述

一、产品简介

PS8101-F3-AX 是瑞萨(RENESAS)推出的一款单通道逻辑输出光耦,面向需要电气隔离且具备中等速率数据传输的工业与电源控制场景。器件采用 DC 输入,输出为逻辑级信号,集成高隔离性能与较好的共模瞬变抗扰性,适用于隔离数据信号与控制回路。

二、主要技术参数

  • 输入类型:DC
  • 工作电压范围:4.5 V ~ 35 V
  • 隔离电压(Vrms):3.75 kV
  • 传输速率:1 Mbit/s
  • 通道数:1(单通道)
  • 工作温度:-55 ℃ ~ +100 ℃
  • 传播延迟:tpLH = 800 ns,tpHL = 1.2 µs
  • 共模瞬变抗扰性(CMTI):15 kV/µs(典型)
  • 耗散功率 Pd:100 mW
  • 封装:SOP-5, 175 mil(窄体 SOP-5 175mil 尺寸)

三、关键特性与优势

  • 高隔离强度:3.75 kVrms 的隔离等级满足多数工业和电源隔离要求,能有效分离高压侧与低压侧信号。
  • 良好的瞬变抗扰能力:15 kV/µs 的共模瞬变抗扰性,有助于在开关电源、电机驱动等含有剧烈 dv/dt 的环境中保持信号完整性。
  • 适合中速数字信号:1 Mbit/s 的传输速率配合亚微秒级别的传播延迟,适用于多种控制与监测链路的逻辑级隔离。
  • 宽工作温度范围:-55~+100 ℃ 适合严苛环境与工业级应用。
  • 小型封装:SOP-5(175 mil)便于 PCB 布局与批量化生产。

四、典型应用场景

  • 隔离式数字信号传输:MCU/FPGA 与高压侧逻辑信号隔离。
  • 电源与逆变器控制:PWM 参考或状态回传的隔离。
  • 工业控制与自动化:PLC 输入/输出隔离、传感器信号隔离。
  • 测试测量设备:在高压测试台中传输低压逻辑信号而保持人员与设备安全。

五、封装与可靠性建议

  • 使用 SOP-5(175 mil)封装时,注意焊接工艺控制与回流温度曲线,避免过热影响器件可靠性。
  • 由于器件隔离为 3.75 kVrms,PCB 设计应结合器件的爬电距离与气隙要求,保证符合系统的安全隔离规范。
  • 在高 dv/dt 环境下,推荐在输入/输出侧增加适当的滤波与去耦,减少误触发概率。

六、设计注意事项

  • 虽然器件提供逻辑输出,但实际系统中应根据输出侧负载选择合适的上拉/下拉电阻,并注意耗散功率限制(Pd=100 mW)以防过热。
  • 布局时将高压侧与低压侧走线分区,避免穿越隔离区域;关键信号的旁路电容应靠近对应引脚放置以提高抗扰性。
  • 在需要更高隔离或更快响应的场合,应评估是否需要更高等级器件或补充隔离措施。

以上为 PS8101-F3-AX 的产品概览及工程应用要点,供器件选型与系统设计参考。如需更详细的电气特性曲线、引脚定义或参考电路,请参阅瑞萨官方数据手册。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.