WMSIC Electronic Components

RENESAS 9DB403DGLFT

Model9DB403DGLFT
PackageTSSOP-28
BrandRENESAS
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 24+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
RENESAS 9DB403DGLFT
Type
RENESAS
Minimum package
2000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
RENESAS
Electronic Component
9DB403DGLFT
Electronic Component
1
Package
TSSOP-28
Electronic Component
Clock Buffer / Driver / Distributor
Electronic Component
0.36g
Electronic Component
1
Features
Built-in; Output
Electronic Component
BM0257437670
Operating Voltage
3.3V
Channel Count
1
Output Channel Count
4
Output Frequency
400MHz
Electronic Component
Electronic Component
Electronic Component
2000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

9DB403DGLFT 产品概述

一、产品简介

9DB403DGLFT 为瑞萨(RENESAS)出品的一款高速 PCI‑Express(PCIe)扇出缓冲器(zero‑delay buffer)。器件集成锁相环(PLL),支持单路输入到四路差分输出的 1:4 分配,输入为 HCSL 差分,输出可提供 HCSL 或 LVDS 差分信号。器件工作频率最高可达 400MHz,供电电压范围为 3.135V ~ 3.465V(典型接近 3.3V),工作温度为 0°C ~ 70°C,封装为表面贴装 TSSOP‑28,适用于商用温度等级的系统设计。

二、主要特性

  • 1:4 差分扇出,单通道分配器,减少外部时钟树复杂度;
  • 集成 PLL,实现零延迟(zero‑delay)输出,同步输入时钟与输出;
  • 支持 HCSL 输入,输出兼容 HCSL 与 LVDS 差分标准,便于与多类接收端接口对接;
  • 最高工作频率 400MHz,满足高频时钟分配需求;
  • 单一供电轨 3.135V~3.465V,封装为 28 引脚 TSSOP,表面贴装便于自动化生产。

三、典型应用

适用于 PCIe 时钟分配(主板、扩展卡、交换机)、高性能服务器与存储设备、FPGA/ASIC 时钟分配、以及其他需低抖动、低延迟差分时钟分配的高速串行链路系统。

四、电气与环境参数(要点)

  • 供电:3.135V ~ 3.465V(建议按数据手册指定电源滤波与去耦);
  • 频率:最高 400MHz;
  • 差分:输入/输出均为差分信号;输入为 HCSL,输出支持 HCSL 或 LVDS;
  • 工作温度:0°C ~ 70°C(商业级);
  • 封装:TSSOP‑28,表面贴装。

五、PCB 设计与布局建议

为保证时钟完整性与最低抖动,应遵循以下实务建议:

  • 在 VCC 引脚附近放置适当的去耦电容(例如 0.1µF 与 1µF 组合),靠近引脚焊盘布置;
  • 差分走线长度匹配、阻抗控制并尽量缩短回流路径,避免不必要的弯折与 via;
  • LVDS 差分对在接收端并联 100Ω 差分终端(或按接收器要求终端),HCSL 终端按目标接口规范或参考瑞萨数据手册实施;
  • 将时钟缓冲器放置在时钟源与主要负载之间的中心位置,减少分支路径与时延不均;
  • 注意电源地平面完整性,避免数字噪声耦合到时钟源。

六、选型要点与替代考虑

选择 9DB403DGLFT 时,应重点确认目标系统对频率(≤400MHz)、差分接口类型(HCSL/LVDS)、工作温度与供电电压的匹配。若需更宽温度范围、不同输出通道数或更低抖动性能,可比较同类零延迟缓冲器或其他厂商对应产品,关注抖动、输出驱动能力、使能/失能控制及功耗参数。

七、注意事项

器件在不同输出标准间的使用细节(例如是否需要外部偏置、AC 耦合或特定终端)请依据瑞萨官方数据手册与接收端规范实施。新设计建议先在评估板上验证时钟完整性、抖动与相位关系,再进行系统级布局。

八、小结

9DB403DGLFT 为面向 PCIe 等高速差分时钟分配的零延迟扇出缓冲器,集成 PLL、1:4 差分输出、支持 HCSL/LVDS,适合需要低延迟、集中时钟管理的商用电子系统。设计时请结合瑞萨数据手册与目标接口规范,按 PCB 布局与终端要求完成实现,以确保最佳时序与信号完整性。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.