WMSIC Electronic Components

RENESAS R7FA2L1AB2DFM#AA0 R7FA2L1AB2DFM

ModelR7FA2L1AB2DFM#AA0
PackageLQFP-64(10x10)
BrandRENESAS
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Electronic Component

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
RENESAS R7FA2L1AB2DFM#AA0
Type
RENESAS
Minimum package
25 托盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
RENESAS
Electronic Component
R7FA2L1AB2DFM#AA0
Electronic Component
1
Package
LQFP-64(10x10)
Electronic Component
MCU(MCU / MPU / SOC)
Electronic Component
3g
CPU
32 Bit
CPU
ARM Cortex-M23
I / O
53
RAM
32KB
Electronic Component
1
ADC
12bit
DAC
12bit
EEPROM
8KB
Electronic Component
BM0257222502

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

R7FA2L1AB2DFM#AA0 产品概述

一、产品概要

R7FA2L1AB2DFM#AA0 是瑞萨(RENESAS)推出的一款基于 ARM Cortex‑M23 内核的 32 位低功耗 MCU。内核主频最高可达 48MHz,片上资源包括 256KB Flash 程序存储、32KB SRAM、8KB EEPROM,53 路通用 I/O,集成 12bit ADC 与 12bit DAC,内置振荡器,工作电压范围宽(1.6V~5.5V),工业级工作温度(-40℃~+85℃),封装为 LQFP‑64(10x10)。

二、核心与存储特性

  • 32 位 ARM Cortex‑M23,最高 48MHz,适合低功耗控制与边缘计算任务。
  • 256KB Flash 可部署应用与固件更新策略(如保留区域用于引导或双备份)。
  • 32KB SRAM 满足一般控制循环与中等缓冲需求;8KB EEPROM 提供小容量非易失性参数存储(校准数据、设备配置等)。

三、模拟与数字外设要点

  • ADC:12bit 分辨率,适合传感器读取与精度要求中等的测量应用。设计时注意参考电压稳定、输入阻抗匹配与采样时序以保证有效位(ENOB)。
  • DAC:12bit 输出适用于模拟控制环路或外部模拟驱动,建议增加输出滤波与缓冲放大以降低噪声。
  • I/O:53 路通用端口,可满足多路开关、PWM、通信等互联需求。引脚多采用复用功能,布局时需注意复用冲突与电平兼容性。

四、电源与振荡器建议

  • 宽电压(1.6V~5.5V)使该器件适配多种电源体系,但外设接口电压须与外部器件一致。
  • 内置振荡器便于简化系统设计并降低成本;若需高精度通信或实时计时,建议配合外部晶振或精密时钟源。

五、封装与热/机械注意

  • LQFP‑64(10x10)封装利于中等密度 PCB 布局与手工焊接评估。布板时注意地平面完整、退热与去耦电容集中布局以降低干扰并保证稳定性。

六、典型应用场景

  • 工业控制与数据采集(中等通道数传感器、控制回路)
  • 智能家电与电源管理(参数存储、模拟控制)
  • 便携测量与边缘节点(低功耗、宽电压运行)

七、开发与调试建议

  • 器件兼容 ARM M‑profile 生态,可使用常见编译器与 CMSIS 支持。建议利用瑞萨提供的开发资源、示例和外设驱动以加速开发周期。
  • 系统设计预留调试接口(SWD/JTAG),并在 Flash 分区上预留引导/固件更新空间。

八、设计注意事项与总结

在系统设计中应重点关注 ADC/DAC 的参考与接地、I/O 复用冲突、供电去耦以及时钟精度需求。R7FA2L1AB2DFM#AA0 以其平衡的存储、模拟能力和丰富 I/O,适合对成本、功耗与功能有综合要求的中小型嵌入式应用。运用合理的硬件布局与软件分区策略,可以在工业与消费类产品中获得可靠的性能表现。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.