WMSIC Electronic Components

RENESAS 5PB1108PGGI8

Model5PB1108PGGI8
Package16-TSSOP
BrandRENESAS
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 23+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
RENESAS 5PB1108PGGI8
Type
RENESAS
Minimum package
2500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
RENESAS
Electronic Component
5PB1108PGGI8
Electronic Component
1
Package
16-TSSOP
Electronic Component
Clock Buffer / Driver / Distributor
Electronic Component
0.001g
Electronic Component
1
Features
Output /; and; / Isolated Driver
Electronic Component
BM0264369408
Operating Temperature
40℃~+85℃
Operating Voltage
2.375V~2.625V;1.71V~1.89V;3.135V~3.465V
Output Channel Count
8
Output Frequency
200MHz
Electronic Component
Electronic Component
Electronic Component
2500

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

RENESAS 5PB1108PGGI8 产品概述

一、产品简介

5PB1108PGGI8 是瑞萨(RENESAS)推出的一款高性能时钟分配/隔离驱动器,适用于以 200 MHz 为上限的系统时钟分配场合。器件提供 8 路输出,具备输出使能/关断控制,内置终端与偏置网络,可作为多路扇出或隔离驱动解决方案,封装为 16‑TSSOP,工作温度范围为 -40℃ 至 +85℃。

二、关键参数

  • 最大输出频率:200 MHz(单端/差分取决于系统配置)
  • 输出通道数:8 路
  • 工作电压(器件可支持的不同电源轨范围):
    • 2.375 V ~ 2.625 V
    • 1.71 V ~ 1.89 V
    • 3.135 V ~ 3.465 V
  • 工作温度:-40℃ ~ +85℃
  • 封装:16‑TSSOP
  • 主要功能:输出使能/关断、内部终端与偏置网络、多路扇出与隔离驱动

三、功能特性与优势

  • 输出使能/关断(OE/OD):支持对任一路或全部输出进行快速使能或关断,便于系统节能、时钟管理与上电顺序控制。
  • 内部终端与偏置网络:消除外部大量被动元件的需求,简化 PCB 布局并提高信号完整性,尤其在多输出驱动时可减少反射与基线漂移。
  • 多路扇出/隔离驱动:每路输出可为下游器件提供稳定驱动,支持驱动多个负载,具备隔离功能以减少上游源与下游负载的相互干扰。
  • 宽电压轨兼容:支持多种工作电压范围,方便与不同逻辑电平(低压到常见 3.3 V 级)系统集成。
  • 工业温度等级:适用于工业与消费级应用,能在较宽温度范围内稳定工作。

四、典型应用场景

  • FPGA/ASIC 的时钟分配与隔离
  • 多通道数据采集与 ADC/DAC 前端时钟分配
  • 网络与通信设备的本地时钟放大与驱动
  • 多时钟域系统的时钟隔离与负载驱动
  • 测试与测量设备的参考时钟分配

五、设计与使用建议

  • 电源与去耦:各电源轨靠近芯片电源引脚放置 0.1 μF 与 1 μF 去耦电容,确保高频去耦与低频稳定。
  • 布线与阻抗匹配:输出走线应采用差分或单端受控阻抗,尽量缩短长度并匹配回流路径,必要时在输出端并联小阻(串联阻抗)以抑制振铃。
  • 终端/偏置配置:优先使用器件内部终端与偏置网络,只有在特殊要求下再添加外部终端元件。
  • 输出使能控制:对敏感系统,上电或切换时先禁能输出,待电源稳定与时钟源就绪后再使能输出,以避免毛刺传播。
  • 热管理与布局:16‑TSSOP 封装在高密度布局下需注意散热路径,保持良好地平面与信号隔离。

六、包装与采购

5PB1108PGGI8 采用 16‑TSSOP 封装,适合中高密度 PCB 组装。具体订购编码与可用性请向瑞萨代理或官方网站查询,以获取最新版数据手册与参考设计。

如需更详细的电气特性、引脚定义、时序图和参考电路,请参考 RENESAS 官方数据手册和应用笔记,以便完成系统级验证与 EMI/信号完整性优化。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.