WMSIC Electronic Components

RICHTEK RT6255BHGJ6F

ModelRT6255BHGJ6F
PackageSOT-23-6
BrandRICHTEK
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
RICHTEK RT6255BHGJ6F
Type
RICHTEK
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
RICHTEK
Electronic Component
RT6255BHGJ6F
Electronic Component
1
Package
SOT-23-6
Electronic Component
DC-DC Power Supply IC
Electronic Component
0.04g
Electronic Component
1
Type
Electronic Component
Synchronous
Electronic Component
Electronic Component
BM0230063576
Operating Temperature
40℃~+85℃@(TA)
Operating Voltage
4.5V~18V
Switching Frequency
500kHz
Electronic Component
Electronic Component
Output Voltage
600mV~5V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

RT6255BHGJ6F 产品概述

一、简介

RT6255BHGJ6F 是 RICHTEK(台湾立锜)推出的一款高效降压型 DC-DC 开关稳压器,采用 SOT-23-6 封装,适用于空间受限且需高电流输出的电源设计。芯片内置开关管并采用同步整流结构,在输入电压 4.5V 至 18V 范围内可稳定输出 0.6V 至 5V(可调),最高持续输出电流可达 5A,开关频率为 500kHz,静态电流仅 115µA,工作温度范围 -40℃ 至 +85℃(TA)。

二、主要特性

  • 输入电压范围:4.5V ~ 18V
  • 输出电压范围:0.6V ~ 5V(可通过外接分压电阻调节)
  • 最大输出电流:5A(持续)
  • 开关频率:500kHz(固定)
  • 拓扑:降压(同步整流)
  • 开关管:内置 MOSFET(无需外置开关)
  • 静态电流(Iq):115µA(低待机功耗)
  • 封装:SOT-23-6,单通道设计,适合紧凑 PCB 布局

三、性能亮点

  • 同步整流提高效率,在中高负载下效率表现优异,减少系统发热,有利于散热与可靠性。
  • 500kHz 的工作频率在尺寸与效率之间取得平衡,使外部电感与电容尺寸可控,适合便携及板级点负载。
  • 低静态电流适合对待机功耗敏感的应用场景,同时在轻载时仍能保持较高能效。
  • 宽输入电压兼容多种电源来源(单节以上锂电池、汽车辅助电源经过降压等)。

四、典型应用

  • 移动设备与便携式仪器的主/从点负载电源
  • 工业控制模块、通信设备电源管理
  • 嵌入式系统、单板计算机和模组电源
  • 汽车电子(经过滤的车载电源)和电池供电系统

五、设计与选型建议

  • 外部电感:基于 500kHz 工作频率,建议选用低 DCR、能承受 5A 峰值电流的功率型电感(常见取值范围 0.8µH~2.2µH,具体取决于纹波电流与允许电压跌落)。
  • 电容:输入侧建议使用足够电容值且低 ESR 的陶瓷电容以抑制尖峰;输出侧优先低 ESR MLCC 以减小输出纹波并保证稳定性。
  • PCB 布局:VIN、GND、SW、FB 等节点应尽量缩短回路,输入电容靠近 VIN 与 GND 引脚,开关节点走线避开敏感信号以降低 EMI。
  • 散热:在高电流或高 Vin 条件下注意布铜散热,必要时增加散热铜箔或过孔以提升热阻管理。

六、封装与订购信息

  • 品牌:RICHTEK(台湾立锜)
  • 型号:RT6255BHGJ6F
  • 封装:SOT-23-6(适合小体积应用)
  • 典型评估:建议参考厂商 datasheet 获取完整引脚定义、保护特性(如过流、过温、欠压锁定等)、典型应用电路与布局示例,以确保设计符合电气与热性能要求。

如需典型应用电路图、外部元件建议表(元件型号与规格)或基于特定输入/输出条件的元件选型计算,可提供具体电源参数(Vin、Vout、最大负载、纹波要求等),以便给出更精确的设计方案。

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