WMSIC Electronic Components

RICHTEK RT5789BGJ8F

ModelRT5789BGJ8F
PackageTSOT-23-8
BrandRICHTEK
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
RICHTEK RT5789BGJ8F
Type
RICHTEK
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
RICHTEK
Electronic Component
RT5789BGJ8F
Electronic Component
1
Package
TSOT-23-8
Electronic Component
DC-DC Power Supply IC
Electronic Component
0.04g
Electronic Component
1
Features
Output
Type
Electronic Component
Synchronous
Electronic Component
Electronic Component
BM0230063871
Operating Temperature
40℃~+85℃@(TA)
Operating Voltage
2.5V~6V
Switching Frequency
1.5MHz
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

RT5789BGJ8F 产品概述

一、主要特性

  • 功能类型:降压型(同步整流)
  • 输入电压范围:2.5 V ~ 6.0 V
  • 输出电压范围:600 mV ~ 6.0 V(可调)
  • 输出电流:最大 6 A
  • 开关频率:1.5 MHz(固定)
  • 静态电流(Iq):约 600 µA
  • 开关管:内置高侧/低侧开关(同步整流)
  • 输出通道:单通道
  • 工作温度范围:-40 ℃ ~ +85 ℃(TA)
  • 封装:TSOT-23-8
  • 品牌:RICHTEK(立锜)

二、功能简介

RT5789BGJ8F 为一颗高频率、低静态电流的降压型 DC-DC 转换器,采用同步整流结构以提高轻载至中高负载下的转换效率。固定 1.5 MHz 的开关频率使外部电感与电容尺寸可以最小化,适合空间受限的便携与嵌入式应用。输出电压可从 0.6 V 调整至 6.0 V,支持多种数字与模拟电源轨需求。内置功率开关减少 BOM 复杂度与散热布局难度。

三、优势与典型应用

优势要点:

  • 高集成度:内置开关、同步整流器件与控制电路,简化外部元件设计。
  • 小体积方案:1.5 MHz 高频工作降低被动元件尺寸,适配 TSOT-23-8 小封装。
  • 宽输入与输出范围:适合单节到双节锂电池、5V 总线或其它分布式电源系统。 典型应用:
  • 移动与便携设备电源管理(MCU、FPGA、传感器供电)
  • 通信与工业控制模块的局部降压
  • 电池供电系统、便携式测试仪器、边缘计算节点

四、封装与布局建议

  • 推荐在芯片电源引脚附近并尽量靠近放置输出电容与输入电容,以降低环路寄生与纹波。
  • 高频开关节点走线应最短并避开敏感模拟信号,必要时采用地平面与过孔分散热量。
  • 选择低 ESR 输出电容以稳定环路并减小输出纹波;依据输出电流与负载瞬态选择合适电感值与饱和电流等级。
  • TSOT-23-8 封装散热能力有限,高电流工作时注意热仿真与板上铜箔散热设计。

五、使用注意事项与资料获取

  • 由于不同应用对瞬态响应与保护功能有不同要求,请在设计前参阅官方 datasheet 获取完整电气特性、启动行为、保护机制与典型应用电路。
  • 在靠近满载或高环境温下工作时,请验证热降额并在必要处增加散热措施或改用更大封装的器件。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.