WMSIC Electronic Components

RICHTEK RT6543AGQW

ModelRT6543AGQW
PackageQFN-20-EP(3x3)
BrandRICHTEK
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
RICHTEK RT6543AGQW
Type
RICHTEK
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
RICHTEK
Electronic Component
RT6543AGQW
Electronic Component
1
Package
QFN-20-EP(3x3)
Electronic Component
DC-DC Power Supply IC
Electronic Component
0.121g
Electronic Component
1
Type
Electronic Component
Synchronous
Electronic Component
Electronic Component
BM0230063819
Operating Temperature
40℃~+125℃
Operating Voltage
3V~24V
Switching Frequency
600kHz;400kHz;800kHz
Electronic Component
Electronic Component
Output Voltage
0V~1.8V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

RT6543AGQW 同步降压PWM控制器产品概述

一、产品定位与核心场景

RT6543AGQW是台湾立锜(RICHTEK)针对Intel平台VCCIN AUX/ICL供电优化的单通道同步降压PWM控制器,同时兼容便携式设备、工业嵌入式系统等需要高效率、低待机功耗的单路降压场景。产品聚焦“紧凑设计+灵活功率适配+Intel平台兼容性”三大核心,是笔记本电脑、服务器、工作站等设备辅助供电的优选方案。

二、关键电气参数解析

产品参数围绕Intel供电需求与系统能效优化设计,核心参数如下:

  1. 宽输入电压范围:支持3V~24V输入,覆盖12V系统主电源、3.3V辅助电源、电池供电等常见电源源,适配不同系统的电源架构;
  2. 可调开关频率:提供400kHz、600kHz、800kHz三档可选,可根据设计需求平衡“效率”与“功率密度”——高频(800kHz)适配轻薄设备(小电感/电容),低频(400kHz)提升重载效率(适用于服务器长时间运行);
  3. 低静态电流:待机模式下Iq仅300μA,显著降低系统待机功耗,延长笔记本等电池设备的待机时间;
  4. 同步整流设计:内置同步整流驱动电路,配合外置MOS管实现续流,相比异步拓扑减少续流二极管损耗,轻载至重载下效率均超90%;
  5. 单通道拓扑:专注单路输出设计,简化电路布局,降低PCB复杂度。

三、拓扑与设计优势

  1. 同步降压拓扑的效率优势:同步整流避免了异步拓扑中续流二极管的正向压降损耗,在12V转低电压(如1V以下)场景中效率提升明显;
  2. 外置MOS的灵活适配:开关管采用外置设计,用户可根据实际输出功率选择合适MOSFET(如不同Rdson、电流能力),无需受限于内置MOS的功率上限,适配1A~10A(依MOS选择)输出范围;
  3. 低Iq的待机优化:300μA静态电流远低于同类通用控制器,适合笔记本待机、服务器低负载待机等对功耗敏感场景;
  4. 频率可调的设计灵活性:三档频率可选,匹配不同电感/电容规格——800kHz可选用2.2μH小体积电感,400kHz可选用4.7μH高纹波抑制电感,兼顾灵活性与性能。

四、封装与散热表现

  1. 超小封装:采用QFN20-EP(3×3mm)封装,相比传统SOP封装体积减少60%以上,适配笔记本主板、服务器节点等紧凑空间;
  2. EP散热增强:封装底部暴露焊盘(EP)直接连接PCB铜箔,热阻低至10℃/W左右,可有效散发布局紧凑下的热量,多数场景无需额外散热片。

五、典型应用场景

  1. Intel平台辅助供电:笔记本电脑、服务器、工作站的VCCIN AUX(CPU辅助供电)、ICL(集成时钟供电)等场景,满足Intel平台供电规范;
  2. 便携式设备:平板电脑、移动电源等需要高效率、低待机的单路降压供电;
  3. 工业嵌入式系统:工业控制板、物联网网关等需要宽输入、高可靠性的单路电源转换。

六、兼容性与系统适配

  1. Intel平台认证:针对Intel VCCIN AUX/ICL规范优化,直接匹配Intel CPU供电需求,减少兼容性测试成本;
  2. 功率扩展灵活:外置MOS支持功率升级,选用低Rdson MOSFET可实现10A以上输出,适配高负载场景;
  3. 宽输入适配:3V~24V输入兼容AC-DC电源、电池组、太阳能板等多种输入源,降低系统设计复杂度。

总结:RT6543AGQW以“高集成度+灵活功率+Intel兼容性”为核心,是紧凑空间、高效率供电场景的实用方案,尤其适合Intel平台设备的辅助供电需求。

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