Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
ROQANG RVT1H4R7M0405
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- ROQANG RVT1H4R7M0405
- Type
- ROQANG
- Minimum package
- 2000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- ROQANG
- Electronic Component
- RVT1H4R7M0405
- Electronic Component
- 1
- Electronic Component
- 4.7uF
- Package
- SMD,4x5.4mm
- Electronic Component
- SMD Aluminum Electrolytic Capacitor
- Electronic Component
- ±20%
- Electronic Component
- 0.215g
- Electronic Component
- 1
- Electronic Component
- BM0264860474
- Electronic Component
- 2000hrs@105℃
- Operating Temperature
- 40℃~+105℃
- Current
- 14mA@120Hz
- Voltage
- 50V
- Capacitor
- 4mm
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
RVT1H4R7M0405 产品概述
RVT1H4R7M0405 是 ROQANG（容强）推出的一款贴片铝电解电容，额定容量 4.7μF，额定电压 50V，封装为 SMD（电容体直径 4mm，长度 5.4mm），适合对体积、耐压和长期可靠性有要求的电源去耦与滤波场合。
一、主要参数一览
- 容值：4.7μF（公差 ±20%）
- 额定电压：50V
- 纹波电流：14mA @ 120Hz
- 外形尺寸：D4 × L5.4 mm（SMD）
- 工作温度：-40℃ ~ +105℃
- 工作寿命：2000 小时 @ 105℃
- 品牌：ROQANG（容强）
二、特性与优势
- 小型化封装：D4×L5.4mm 的贴片体积便于高密度 PCB 布局，占板面积小，适用于空间受限的设计。
- 高压能力：50V 额定电压满足较高电源轨与阻断应用需求，比常见的16V/25V 型号有更大耐压余量。
- 工艺与可靠性：2000 小时 @105℃ 的寿命指标表明在高温环境下仍具有稳定的长期性能，适合工业级或要求较高温升的系统。
- 宽工作温度：-40℃ 至 +105℃，覆盖一般工业与商用环境温度范围。
三、典型应用场景
- PCB 电源滤波与去耦：用于中高压电源轨的旁路、平滑纹波与抑制瞬态干扰。
- 信号耦合/旁路：在需要高耐压且体积受限的模拟或混合信号电路中作为耦合或去耦电容。
- 工业与通信设备：适用于电源模块、控制板、通讯基站等对长期可靠性有要求的设备。
- 消费类电子与小型电源适配器：当电路需要 50V 耐压且空间有限时为合适选择。
四、封装与组装建议
- 贴片组装：适配常规 SMD 回流焊工艺，建议遵循制造商给定的回流温度曲线与预热/保温参数，以免影响寿命。
- 布局注意：将电容尽量靠近被去耦的 IC 或电源引脚放置，缩短回流路径以提高滤波效果。
- 焊盘设计：参考 ROQANG 推荐的焊盘尺寸与锡膏印刷工艺，防止焊接应力导致电容体受力或虚焊。
五、可靠性与使用注意
- 老化与泄漏：铝电解电容在长期高温或高压工况下可能出现容量衰减和漏电流上升，设计时应留有裕量并考虑定期检测或更换策略。
- 纹波限制：本型号纹波电流规格为 14mA @120Hz，超出此范围会加速电解液老化，应在实际应用中确认实际纹波电流不超标。
- 存储与搬运：避免潮湿、高温与机械冲击，长时间存放前建议按照厂商说明进行包装条件控制及必要的再流焊前烘烤。
RVT1H4R7M0405 以其紧凑体积、高耐压和工业级温度/寿命特性，适合要求空间节省同时需要较高电压余量与稳定性的电源与滤波设计。如需更详细的电气等效参数、回流曲线或封装尺寸图，请联系 ROQANG（容强）技术支持或索取完整数据手册。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
