Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
ST TSV912IDT
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- ST(STMicroelectronics) TSV912IDT
- Type
- ST
- Minimum package
- 2500 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- ST(STMicroelectronics)
- Electronic Component
- TSV912IDT
- Electronic Component
- 1
- Package
- SO-8
- Electronic Component
- Operational Amplifier
- Electronic Component
- 0.212g
- Electronic Component
- 1
- Electronic Component
- Output
- Features
- Built-in; ESD
- Electronic Component
- BM0000286535
- Operating Temperature
- 40℃~+125℃
- Amplifier
- 2
- Output Current
- 35mA
- (SR)
- 4.5V/us
- Power Supply Voltage
- 2.5V~5.5V
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
TSV912IDT 产品概述
一、产品简介
TSV912IDT 是意法半导体（STMicroelectronics）推出的一款高性能双路通用运算放大器，特别设计用于满足现代电子应用的多样化需求。凭借其低功耗、高增益带宽积和卓越的输入特性，TSV912IDT 成为信号处理、仪器仪表和控制系统等领域的理想选择。
二、基本特性
- 双路设计：TSV912IDT 提供两个独立的放大器通道，便于在同一设备中实施多个信号的处理，缩减设计空间和成本。
- 优越的压摆率：本型号放大器的压摆率达到 4.5V/μs，能够快速响应快速变化的输入信号，适合动态信号处理要求高的应用场景。
- 增益带宽积：增益带宽积为 8MHz，确保在高频信号处理中的有效增益，支持高频测试和控制应用。
- 极低的输入偏置电流：仅为 1pA 的输入偏置电流使得 TSV912IDT 在高输入阻抗电路上表现出色，适合用于高精度测量仪器。
- 低输入失调电压：失调电压低至 100µV，确保在增益较高的情况下依然能够提供准确的输出信号，减少系统误差。
三、供电及功耗
TSV912IDT 支持单电源（±）供电，可在 2.5V 至 5.5V 的电压范围运行。在此范围内，其电源电流仅为 820μA，表现出良好的低功耗特性，对于电池供电的应用尤其重要，有助于延长设备待机时间。
四、输出特性
每个输出通道可提供高达 35mA 的输出电流，支持驱动多种负载，具有满摆幅输出特性，适合多种不同负载条件下的应用，如音频处理、信号调制和数据采集等领域。
五、工作环境
TSV912IDT 的工作温度范围宽广，从 -40°C 到 125°C，适用于各种严苛环境。这一特性确保其在工业、医疗和汽车领域等高温或低温条件下的稳定运行。
六、封装及安装
该产品采用 8-SOIC（0.154"，3.90mm宽）封装方式，适合表面贴装（SMT）工艺，方便大规模生产。其湿气敏感性等级为 1（无限），确保在生产、运输及储存过程中提供良好的稳定性。
七、应用领域
由于以上优越的性能，TSV912IDT 被广泛应用于：
- 精密仪器：如传感器信号放大，ADC 前级放大等。
- 控制系统：在伺服系统、自动化设备中实现信号的精准处理。
- 音频设备：满足音频信号的放大需求。
- 医疗电子：适合用于心电图、血氧监测等生物医疗设备。
八、总结
TSV912IDT 以其卓越的性能和广泛的应用场景，在通用运算放大器市场中占据了重要地位。凭借其极低的输入偏置电流和失调电压，高灵敏度的压摆率和增益带宽积，TSV912IDT 不仅适用于标准的信号放大任务，更是高端应用领域的优选。意法半导体的创新设计和高质量制造确保了其长期的可靠性，是现代电子设计的理想选择。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece Integrated Circuit for IRS20124S IRS21956S SOP-20 IRS2453DS SOP-14
- Model
- IRS20124S
- Package
