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ST STL13N65M2
Configuration
1 options
Configuration
24+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- ST(STMicroelectronics) STL13N65M2
- Type
- ST
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- ST(STMicroelectronics)
- Electronic Component
- STL13N65M2
- Electronic Component
- 1
- Package
- PowerFlat™（5x6）HV
- Electronic Component
- 1 N
- Type
- N
- Electronic Component
- MOSFET
- Electronic Component
- 0.274g
- Electronic Component
- 1
- Electronic Component
- BM0258813117
- Operating Temperature
- 55℃~+150℃
- Power Dissipation(Pd)
- 52W
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
- Voltage(Vdss)
- 650V
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
STL13N65M2 产品概述
一、产品定位与核心参数
STL13N65M2 是意法半导体（ST）推出的一款高压 N 沟道功率 MOSFET，额定漏–源电压 Vdss 为 650V、连续漏极电流 Id 为 6.5A。典型导通电阻 RDS(on) 为 475mΩ（Vgs=10V），栅极电荷 Qg≈17nC（10V），输入电容 Ciss≈590pF，输出电容 Coss≈27.5pF，反向传输电容 Crss≈1.1pF。工作温度范围为 −55℃ 到 +150℃，封装为 PowerFlat™（5×6）HV 带裸露散热焊盘的 8 引脚扁平封装。
二、主要电气特性与设计要点
- 高压特性：650V 的耐压等级适合离线电源及其它宽压差场合。
- 导通与门驱：RDS(on)=475mΩ 在 10V 门压下测得，表明在高压低电流应用中可接受，但用于大电流场合时导通损耗较高，需评估热耗。栅阈值 Vgs(th)=4V（250µA）偏高，器件不是逻辑电平型，建议使用 10V 规整栅极驱动以保证低 RDS(on)。
- 开关损耗：Qg≈17nC 和 Coss、Ciss 等参数决定了驱动能量和开关损耗，开关频率增加时驱动损耗上升需注意驱动器能力与功耗预算。Crss 值较小，有利于减小米勒效应对栅驱的影响。
三、封装与热管理
PowerFlat（5×6）HV 封装带有裸露散热垫（EP），利于通过 PCB 大面积铜箔传热。标称耗散功率 Pd=52W（典型热条件下），实际散热能力强烈依赖 PCB 设计（散热铜箔面积、通孔、热层连接）和环境散热条件。设计时应：
- 在 PCB 下方布置足够铜箔并设计热过孔；
- 在高功率工况评估结温和热阻，保证结温不超过允许值（工作温度上限 150℃）；
- 考虑合适的散热与保护电路（热关断、过流保护）。
四、适用场景与典型应用
- 离线开关电源（如反激/正激原边开关）与适配器主开关；
- 功率因数校正（PFC）辅助开关或低功率级；
- 荧光灯/LED 驱动、电子镇流器、家电控制的小功率高压开关；
- 任何需要 650V 耐压但电流需求中等（几安培级）且对封装平面安装有要求的应用。
五、选型建议与注意事项
- 若工作电流或导通损耗敏感，应考虑更低 RDS(on) 的器件或并联多颗芯片；
- 栅极驱动器需提供足够电流以快速充放 Qg，同时注意驱动能量和 EMI 管理；
- 在高频开关场合评估 Coss 与 Qg 对开关损耗的贡献，必要时加装软开关或缓冲网络降低损耗；
- PCB 热设计与散热焊盘焊接工艺对器件寿命和可靠性至关重要。
六、优势概述
STL13N65M2 在高压耐压与中等电流能力之间提供了平衡，PowerFlat 封装便于低剖面贴装和 PCB 散热，适合需要高耐压、布局紧凑且成本敏感的开关应用。选用时应综合电流、开关频率与散热条件进行评估，以发挥其最佳性能。
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