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ST STPS160AY
Configuration
1 options
Configuration
24+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- ST(STMicroelectronics) STPS160AY
- Type
- ST
- Minimum package
- 5000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- ST(STMicroelectronics)
- Electronic Component
- STPS160AY
- Electronic Component
- 1
- Package
- SMA(DO-214AC)
- Electronic Component
- Schottky Diode
- Electronic Component
- 0.147g
- Electronic Component
- 1
- Electronic Component
- BM0230028525
- Current
- 1A
- Diode
- 1
- Current(Ir)
- 4uA@60V
- (Vf)
- 570mV@1A
- Electronic Component
- 40℃~+150℃
- Electronic Component
- Electronic Component
- Electronic Component
- 5000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
STPS160AY 肖特基二极管产品概述
一、产品简介
STPS160AY 是意法半导体（ST）推出的一款肖特基势垒整流二极管，额定平均整流电流为1A，直流反向耐压60V，采用SMA（DO‑214AC）封装。该器件以低正向压降和快速开关特性为主要卖点，适合高频开关电源、整流和保护电路中对效率和响应速度有要求的场合。
二、主要电气参数
- 正向压降 (Vf)：约 570 mV @ 1 A
- 直流反向耐压 (Vr)：60 V
- 额定整流电流：1 A（平均）
- 反向漏电流 (Ir)：约 4 μA @ 60 V（温度相关）
- 非重复峰值浪涌电流 (Ifsm)：75 A（冲击能力，用于短时浪涌）
- 工作结温范围：-40 ℃ 至 +150 ℃
三、主要特点
- 低正向压降：在同等电流条件下比普通快恢复二极管具有更小的压降，降低导通损耗，提高系统效率。
- 快速切换、无恢复时间：肖特基结构几乎没有反向恢复，适合高频开关场合，减少开关损耗和电磁干扰。
- 小封装、大能力：SMA 封装在有限面积内兼顾适当的热散与机械强度，适合空间受限的电源板设计。
- 良好的浪涌承受能力：75A 的峰值浪涌能力可应对启动冲击或瞬态过电流情形（短时）。
四、典型应用
- 开关电源（整流、续流二极管）
- DC–DC 转换器输出整流
- 逆接/反向保护电路
- 电池充放电路径、功率管理模块
- 需低压降、高频率整流的电子设备
五、封装与热管理
SMA（DO‑214AC）封装便于自动贴片与回流焊接，但热阻相对较大。实际设计中应注意：
- 合理的焊盘与铜箔面积以提升散热能力；必要时在 PCB 背面增加铜层或散热过孔。
- 在高温环境或持续靠近额定电流工作时，应对正向压降与反向漏流随温度上升的影响进行预估与热降额。
六、选型与使用建议
- 若电路长期在高温或接近1A工作，应关注反向漏电流随温度增加的问题，必要时留有余量或选择更高电流级别器件。
- 浪涌能力用于短时冲击，不应作为常态工作指标；对频繁的大电流冲击，应选择更高 Ifsm 的封装或并联方案，并注意均流问题。
- 如果需要更高耐压或更低 Vf，可参考同厂更高压或更大电流等级的肖特基器件。
七、可靠性与注意事项
- 注意焊接工艺控制，避免过高的回流峰值温度和长时间高温暴露。
- 在高反向电压与温度条件下，器件的漏电流会显著增加，可能影响待机损耗和热稳定性。
- 设计时做好热仿真与实测，确保结温不超过规格上限，从而保证长期可靠性。
总体而言，STPS160AY 适用于中低功率、高频整流与保护场景，凭借低 Vf 和快速响应可在提升效率与减小器件数量方面带来优势。
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