WMSIC Electronic Components

ST M95M01-DFMN6TP M95M01

ModelM95M01-DFMN6TP
Package8-SO
BrandST
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
ST(STMicroelectronics) M95M01-DFMN6TP
Type
ST
Minimum package
2500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
ST(STMicroelectronics)
Electronic Component
M95M01-DFMN6TP
Electronic Component
1
Package
8-SO
Electronic Component
EEPROM
Electronic Component
0.25g
Electronic Component
1
Features
Built-in positions(POR);; Built-in Latch(WEL); Built-in (ECC)
Electronic Component
BM0058408568
Electronic Component
1Mbit
Operating Temperature
40℃~+85℃
Operating Voltage
1.7V~5.5V
Interface Type
SPI
Electronic Component
400
Clock Frequency(fc)
16MHz

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

M95M01-DFMN6TP 产品概述

一、产品简介

M95M01-DFMN6TP 是意法半导体(ST)系列的 SPI 接口串行 EEPROM,存储容量 1 Mbit(128 kB),针对工业级和消费类低功耗系统优化设计。器件支持宽工作电压与宽温度范围,适合对数据保持性和写入寿命有较高要求的应用场合。

二、主要规格参数

  • 接口类型:SPI 串行接口,兼容标准 SPI 协议,最大时钟频率 fc = 16 MHz
  • 存储容量:1 Mbit(128 kB)
  • 工作电压:1.7 V ~ 5.5 V(支持低压电源和 5 V 系统)
  • 写周期时间(Tw):典型 5 ms(单次写入完成时间)
  • 数据保持(TDR):200 年
  • 擦/写周期寿命:4,000,000 次(高耐久)
  • 工作温度:-40 ℃ ~ +85 ℃
  • 封装:8-SO(SO-8)

三、关键特性与优势

  • 宽电压范围:1.7 V 起动,便于与低功耗 MCU、锂电池供电系统直接配合,亦兼容 5 V 逻辑。
  • 高耐久与超长保持:400 万次写周期和 200 年的数据保持,适合频繁更新且需长期保存配置或日志的场景。
  • 标准 SPI 接口:简单的四线 SPI 通讯,易于在现有系统中替换或扩展,最高 16 MHz 时钟可满足较高吞吐需求。
  • 工业级温度范围:-40 ℃ 至 +85 ℃,可靠性高,适合工业与车载周边环境(需按系统规范评估)。

四、典型应用场景

  • 参数存储与系统配置(MCU 引导参数、校准系数)
  • 数据记录与循环日志(事件记录、运行统计)
  • 消费类与工业控制器的固件配置备份
  • 安防、仪表及少量频繁写入的非易失性缓存

五、设计与使用建议

  • 电源完整性:在 VCC 引脚附近放置 0.1 µF 陶瓷去耦电容,降低电源噪声,保证写操作期间电压稳定。
  • 写入管理:写操作典型需要 5 ms。建议在写入后通过读取状态寄存器中的写入完成标志(WIP)或延时确认写入完成,避免在写周期内掉电导致数据不一致。
  • 保护策略:若系统支持,请启用器件的写保护功能(硬件或软件);在多主 SPI 总线环境下,确保片选(CS)和时钟线的正确释放与防抖处理。
  • 电平匹配:当 MCU 电压与 EEPROM 电压不同时,考虑使用电平移位或选择共同电源域以避免接口损伤。
  • 环境评估:在极端温度或高辐射场合应进一步做应力验证,确保长期可靠运行。

六、封装与采购信息

  • 品牌:ST(意法半导体)
  • 封装:8-SO(SO-8)封装,适用于通用 PCB 布局,焊接与手板验证方便。
  • 型号:M95M01-DFMN6TP(请在采购前核对完整器件编号与封装代码,确保与系统需求一致)。

本产品以其宽电压、长数据保持与高写入寿命的特点,适合需要高可靠性存储的嵌入式系统与工业应用。在具体设计中,请参照器件完整数据手册并结合系统级测试与验证。

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