WMSIC Electronic Components

ST TSV992IST

ModelTSV992IST
Package8-MiniSO
BrandST
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 24+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
ST(STMicroelectronics) TSV992IST
Type
ST
Unit
Electronic Component
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
ST(STMicroelectronics)
Electronic Component
TSV992IST
Electronic Component
1
Package
8-MiniSO
Electronic Component
Operational Amplifier
Electronic Component
0.142g
Electronic Component
1
Electronic Component
Output
Features
Electronic Component
Electronic Component
BM0258813124
Operating Temperature
40℃~+125℃
Amplifier
2
Output Current
35mA
(SR)
10V/us

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TSV992IST 运算放大器产品概述

一、器件简介

TSV992IST 是意法半导体(ST)推出的双路运算放大器,封装为 MiniSO-8,面向空间有限且要求低功耗、低噪声的便携与工业应用。器件支持单电源工作,工作温度范围为 −40℃ 到 +125℃,适合苛刻环境下的长期使用。

二、主要电气参数

  • 放大器数:双路
  • 最大电源宽度 (VDD−VSS):6V
  • 单电源工作电压范围:2.5V ~ 5.5V
  • 输入失调电压 (Vos):典型 4.5 mV
  • 输入失调电压温漂 (Vos TC):2 μV/℃
  • 压摆率 (SR):10 V/μs
  • 输入偏置电流 (Ib):100 pA(典型,适合高阻抗源)
  • 噪声密度 (eN):21 nV/√Hz @ 10 kHz
  • 共模抑制比 (CMRR):82 dB
  • 工作温度范围:−40℃ ~ +125℃

三、性能亮点与应用价值

  • 低输入偏置电流(约 100 pA),使其非常适合与高阻抗传感器(如电化学传感器、光电二极管、微弱电流采集)配合使用。
  • 低噪声密度(21 nV/√Hz @10 kHz)和较低的失调漂移(2 μV/℃)有利于构建低噪声前端和精密放大电路。
  • 10 V/μs 的压摆率支持中等带宽信号的快速响应,适合滤波器、ADC 驱动和快速采样场景。
  • 宽温度范围与单电源低电压工作(2.5–5.5V)适合电池供电和工业级应用。

四、典型应用场景

  • 传感器前端放大(温度、压力、流量、化学传感器等)
  • 仪表放大器、差分信号放大器与精密测量电路(需注意 Vos 大小时的校正)
  • 模拟滤波器和采样保持缓冲器
  • 光电检测的跨阻放大器(利用低 Ib 提高灵敏度)
  • 便携式/电池供电设备的信号调理与 ADC 驱动

五、设计与使用注意事项

  • 虽具备单电源低压工作能力,但在高精度场合应参考完整数据手册确认输入共模范围与输出摆幅限制,避免超出线性区。
  • 输入失调电压约 4.5 mV,对于要求亚毫伏级精度的系统需考虑外部校准、失调调节或差分放大结构降低影响。
  • 推荐在电源端做贴片去耦(如 0.1 μF 与 1 μF 组合)并合理布线,降低噪声与振荡风险。
  • 对于高增益配置,注意输入与反馈网络的阻抗匹配,以减小噪声与失真。
  • 封装为 MiniSO-8,有利于节省 PCB 面积,但焊接与散热时应注意温升管理与制造可行性。

六、总结

TSV992IST 在小体积封装内集成了双通道、低偏置电流与低噪声特性,适合便携与工业级传感器前端、信号调理与中等带宽模拟应用。使用时应结合系统精度需求和输入共模/输出摆幅限制进行电路设计与校准,以发挥器件的最佳性能。欲获取完整电气特性、引脚排列和典型应用电路,请参考 ST 官方数据手册。

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