WMSIC Electronic Components

ST TSV772IST

ModelTSV772IST
PackageMiniSO-8
BrandST
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 23+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
ST(STMicroelectronics) TSV772IST
Type
ST
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
ST(STMicroelectronics)
Electronic Component
TSV772IST
Electronic Component
1
Package
MiniSO-8
Electronic Component
Operational Amplifier
Electronic Component
0.52g
Electronic Component
1
Electronic Component
Output
Features
Built-in
Electronic Component
BM0230266159
Operating Temperature
40℃~+125℃
Amplifier
2
Output Current
65mA
(SR)
13V/us
Power Supply Voltage
2V~5.5V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TSV772IST 产品概述

一、主要特性

TSV772IST 是一款由 ST(意法半导体)提供的双路运算放大器,突出低噪声、低偏置电流和轨到轨输入/输出能力,适用于对精度与带宽有平衡要求的便携与工业应用。主要参数包括:增益带宽积(GBP)20 MHz,压摆率(SR)13 V/μs,输入失调电压典型 200 μV,输入偏置电流仅 75 pA,输入失调电流 1 pA,噪声密度 7 nV/√Hz(@10 kHz),共模抑制比(CMRR)可达 120 dB。器件为双通道,封装为 MiniSO-8。

二、性能亮点

  • 轨到轨输入与轨到轨输出,支持更宽的输入/输出摆幅,适合低电压单电源系统。
  • 宽工作电压范围:单电源 2 V 至 5.5 V(Vdd−Vss 最大 5.5 V)。
  • 卓越的低偏置与低失调特性(Vos 200 μV,Ib 75 pA、Ios 1 pA),有利于高输入阻抗与精密测量。
  • 中等带宽与较高压摆率(GBP 20 MHz,SR 13 V/μs),在驱动较快信号与滤波器设计时具有良好响应。
  • 低噪声(7 nV/√Hz@10 kHz)适合低电平信号处理。

三、典型应用

  • 便携式仪器与传感器前端(电池供电 2 V 起)。
  • 精密放大器、仪表放大器输入级与差分放大器。
  • 主动滤波器、采样保持放大器与数据采集前端。
  • 音频前级和低噪声信号链。

四、封装与电源

封装:MiniSO-8,便于 PCB 密度较高的设计。静态电流(Iq)典型 1.9 mA,输出驱动能力高达 65 mA,可短时驱动较大负载,但建议在连续大电流输出场景下评估热量与功耗。

五、设计与布局建议

  • 电源去耦:靠近封装放置 0.1 μF 陶瓷和 1 μF 低 ESR 电容,抑制高频噪声与瞬态。
  • 输入保护与偏置:对于极低 Ib/Ios 的放大器,应注意 PCB 卫星电阻、漏电流与污染,必要时使用防护电阻或聚四氟层(guard)技术减小泄漏路径。
  • 驱动容性负载:若需驱动较大电容负载,建议在输出端串联小阻抗(10–100 Ω)以保证稳定性并减少振铃。
  • 温漂管理:输入失调温漂约 700 μV/°C,长期精密应用需通过电路校准或环境控制降低漂移影响。

六、关键参数速览

  • 放大器数:双路
  • 工作电压:2 V ~ 5.5 V(Vdd−Vss 最大 5.5 V)
  • 轨到轨:输入/输出均为轨到轨
  • GBP:20 MHz
  • 压摆率:13 V/μs
  • 输入失调电压:200 μV(典型)
  • 输入失调电压温漂:700 μV/°C
  • 输入偏置电流:75 pA
  • 输入失调电流:1 pA
  • 噪声密度:7 nV/√Hz @10 kHz
  • CMRR:120 dB
  • 静态电流:1.9 mA(典型)
  • 输出电流:65 mA
  • 工作温度:−40 °C ~ +125 °C
  • 封装:MiniSO-8

七、注意事项与可靠性

在高精度或高温环境应用中,应关注偏置与失调随温度的变化,并设计必要的校准或漂移补偿。高阻抗输入路径需严格控制 PCB 清洁度与漏电路径,以发挥 pA 级偏置电流性能。总体而言,TSV772IST 在低电压、低噪声与精密测量场合表现优异,是兼顾带宽与精度的通用双路运放选择。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.