WMSIC Electronic Components

Sunlord SDCL0603Q56NJT02B03

ModelSDCL0603Q56NJT02B03
Package0201
BrandSUNLORD
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Sunlord SDCL0603Q56NJT02B03
Type
0201
Minimum package
15000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
SUNLORD
Electronic Component
SDCL0603Q56NJT02B03
Electronic Component
1
Package
0201
Electronic Component
SMD Inductor
Electronic Component
±5%
Electronic Component
0.009g
Inductor
56nH
Electronic Component
1
Factor
11@300MHz
Electronic Component
BM0265147300
Current
100mA
Frequency
1.4GHz
Resistor(DCR)
2.8Ω
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SDCL0603Q56NJT02B03 产品概述

1. 产品简介

SDCL0603Q56NJT02B03 是一款由 Sunlord(顺络)公司生产的高频贴片电感,采用 0201 封装,适用于高频电路中的滤波、匹配和调谐等应用。该电感具有优异的 Q 值、低直流电阻(DCR)和高自谐振频率(SRF),能够在高频环境下保持稳定的性能。

2. 主要参数

  • 电感值 (Inductance): 56nH
  • 精度 (Tolerance): ±5%
  • Q 值 (Quality Factor): 11 @ 300MHz
  • 直流电阻 (DCR): 2.8Ω
  • 自谐振频率 (SRF): 1.4GHz
  • 额定电流 (Rated Current): 100mA
  • 封装 (Package): 0201

3. 产品特点

  • 高频性能优异: 该电感在 300MHz 频率下的 Q 值高达 11,确保了在高频应用中的低损耗和高效率。
  • 低直流电阻: 直流电阻仅为 2.8Ω,减少了功率损耗,提高了电路的效率。
  • 高自谐振频率: 自谐振频率达到 1.4GHz,适用于高频电路设计,确保在宽频带内保持稳定的电感值。
  • 小尺寸封装: 采用 0201 封装,体积小巧,适合高密度 PCB 布局,满足现代电子设备小型化的需求。
  • 高精度: 电感值精度为 ±5%,确保了电路设计的精确性和一致性。
  • 高可靠性: 由 Sunlord(顺络)公司生产,品质可靠,广泛应用于通信、消费电子、汽车电子等领域。

4. 应用领域

SDCL0603Q56NJT02B03 广泛应用于以下领域:

  • 通信设备: 用于射频模块、天线匹配、滤波器等高频电路。
  • 消费电子: 应用于智能手机、平板电脑、笔记本电脑等设备中的高频电路。
  • 汽车电子: 用于车载通信系统、导航系统、娱乐系统等高频电路。
  • 工业电子: 应用于工业控制、自动化设备、传感器等高频电路。

5. 技术优势

  • 高频稳定性: 在高频环境下,电感值稳定,Q 值高,确保了电路的稳定性和可靠性。
  • 低损耗: 低直流电阻和高 Q 值减少了功率损耗,提高了电路的效率。
  • 小型化设计: 0201 封装适合高密度 PCB 布局,满足现代电子设备小型化的需求。
  • 宽频带应用: 高自谐振频率使其适用于宽频带应用,满足多种高频电路设计需求。

6. 使用注意事项

  • 焊接温度: 建议使用回流焊工艺,焊接温度不超过 260℃,焊接时间不超过 10 秒。
  • 存储环境: 产品应存放在干燥、无尘的环境中,避免高温和高湿。
  • 电气性能: 在实际应用中,应确保电感的工作电流不超过额定电流,以避免过热和损坏。

7. 结论

SDCL0603Q56NJT02B03 是一款高性能的高频贴片电感,具有优异的 Q 值、低直流电阻和高自谐振频率,适用于多种高频电路设计。其小型化封装和高精度特性,使其成为现代电子设备中不可或缺的元器件。无论是在通信设备、消费电子、汽车电子还是工业电子领域,SDCL0603Q56NJT02B03 都能提供稳定可靠的性能,满足各种高频应用的需求。

通过以上概述,可以看出 SDCL0603Q56NJT02B03 是一款性能卓越、应用广泛的高频贴片电感,适合各种高频电路设计,是现代电子设备中不可或缺的元器件。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.