WMSIC Electronic Components

Sunlord SDCL0603Q22NJT02B03

ModelSDCL0603Q22NJT02B03
Package0201
BrandSUNLORD
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Sunlord SDCL0603Q22NJT02B03
Type
0201
Minimum package
15000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
SUNLORD
Electronic Component
SDCL0603Q22NJT02B03
Electronic Component
1
Package
0201
Electronic Component
SMD Inductor
Electronic Component
±5%
Electronic Component
0.009g
Inductor
22nH
Electronic Component
1
Factor
13@500MHz
Electronic Component
BM0264825688
Current
150mA
Frequency
2.2GHz
Resistor(DCR)
1.2Ω
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

Sunlord SDCL0603Q22NJT02B03 贴片电感产品概述

一、产品基本信息

SDCL0603Q22NJT02B03是顺络电子(Sunlord)推出的高频贴片电感,属于公司0201封装系列的核心产品。该电感针对射频通信、物联网终端等场景设计,兼具小体积、高频性能优异、低损耗等特点,是现代电子设备射频电路中常用的匹配/滤波元件,可满足轻薄化、高密度PCB布局的设计需求。

二、核心电气参数解析

  1. 电感值与精度:标称电感值22nH,精度±5%,满足多数射频电路对电感匹配的精准度要求,可减少电路调试复杂度。
  2. 额定电流:最大允许直流电流150mA,定义了电感在正常工作温度范围(-40℃~+85℃)内的稳定工作电流,适配低功耗射频电路设计。
  3. 直流电阻(DCR):典型值1.2Ω,低DCR意味着电感直流损耗小,能有效提升电路能量效率,减少设备发热问题。
  4. 品质因数(Q值):500MHz工作频率下Q值为13,Q值反映电感储能与损耗的比值,较高的Q值可提升谐振电路的选择性、滤波电路的带外抑制性能。
  5. 自谐振频率(SRF):自谐振频率2.2GHz,当工作频率接近SRF时,电感感抗与分布电容容抗抵消呈纯阻性;超过SRF后呈容性。2.2GHz的SRF覆盖2.4GHz、5GHz等主流通信频段附近,避免高频下性能劣化。

三、封装与物理特性

该产品采用0201英制贴片封装,尺寸为0.02英寸(长)×0.01英寸(宽),对应公制尺寸0.508mm×0.254mm,体积超小,可大幅节省PCB空间,适配轻薄化电子设备的设计趋势。

封装采用贴片式结构,兼容自动化表面贴装(SMT)生产线,支持高速批量生产,降低制造成本。此外,电感采用顺络成熟的绕制工艺,具备良好的机械稳定性,抗振动、耐冲击能力强,适应工业级、消费级等多种应用环境。

四、典型应用场景

SDCL0603Q22NJT02B03因高频性能优异、体积小巧,广泛应用于以下场景:

  1. 射频通信设备:蓝牙(2.4GHz)、WiFi(2.4GHz/5GHz)、无线局域网(WLAN)等设备的射频前端匹配网络、滤波电路,提升信号传输质量。
  2. 物联网(IoT)终端:低功耗传感器节点、智能穿戴设备(智能手环、手表)的无线通信模块,满足小型化与低功耗需求。
  3. 消费电子:智能手机、平板电脑的天线匹配电路、射频信号滤波,优化无线信号收发性能。
  4. 工业无线通信:ZigBee、LoRa等短距离无线数据传输模块,保障工业环境下的稳定通信。
  5. 高频测试仪器:小型化射频测试设备(信号发生器、频谱分析仪)的内部匹配电路,实现高精度信号处理。

五、产品优势与价值

  1. 小体积高密度:0201封装可适配紧凑PCB布局,满足现代电子设备轻薄化设计需求。
  2. 高频性能突出:Q值13@500MHz、SRF2.2GHz,覆盖主流射频频段,满足高频电路性能要求。
  3. 低损耗高效率:1.2Ω低DCR减少直流损耗,提升电路能量效率,降低设备发热。
  4. 高可靠性:顺络成熟工艺确保产品在宽温度范围(-40℃~+85℃)内性能稳定,抗振动、耐老化能力强。
  5. 生产适配性强:贴片封装支持SMT自动贴装,适合大规模批量生产,降低生产成本与人工成本。

该产品凭借上述特点,成为射频电路设计中高频电感的优选方案,可有效提升设备的无线通信性能与可靠性。

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