Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Sunlord SDCL0603Q4N3HT02B03
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- Sunlord SDCL0603Q4N3HT02B03
- Type
- SUNLORD
- Minimum package
- 15000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- SUNLORD
- Electronic Component
- SDCL0603Q4N3HT02B03
- Electronic Component
- 1
- Package
- 0201
- Electronic Component
- SMD Inductor
- Electronic Component
- ±3%
- Electronic Component
- 0.009g
- Inductor
- 4.3nH
- Electronic Component
- 1
- Factor
- 13@500MHz
- Electronic Component
- BM0264913687
- Current
- 350mA
- Frequency
- 6.8GHz
- Resistor(DCR)
- 400mΩ
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
顺络SDCL0603Q4N3HT02B03贴片电感产品概述
一、产品基本信息
SDCL0603Q4N3HT02B03是顺络电子（Sunlord） 推出的高频贴片电感，型号命名对应核心特性：“0603”为英制封装代码，“4N3”表示标称电感值4.3nH，后缀体现性能等级与工艺特性。该产品采用0201英制贴片封装，无引线设计适配表面贴装工艺（SMT），是小型化电子设备射频电路的常用元件。
二、核心电气参数详解
该电感参数针对高频应用优化，各指标的实际价值如下：
- 电感值与精度：标称4.3nH，精度±3%。射频电路对匹配精度要求高，±3%的精度可满足天线匹配、滤波器设计的精准度需求，减少信号反射损耗。
- 额定电流：长期额定电流350mA。指25℃环境下可稳定工作的最大直流电流，超过此值可能导致磁芯饱和或过热，需结合应用留裕量。
- 直流电阻（DCR）：典型值400mΩ（0.4Ω）。低DCR减少直流功率损耗，降低发热，尤其适合电池供电的便携式设备，延长续航。
- 品质因数（Q值）：500MHz下Q值13。Q值反映储能与损耗比，500MHz（覆盖蓝牙/WiFi谐波范围）下13的Q值可降低射频插入损耗。
- 自谐振频率（SRF）：典型值6.8GHz。自谐振是电感与寄生电容的谐振点，SRF＞6GHz意味着在2.4GHz/5GHz主流无线频段内，电感可稳定工作，避免谐振干扰。
三、封装与物理特性
采用0201英制贴片封装，物理尺寸约0.60mm（长）×0.30mm（宽）×0.30mm（高），体积小巧，适配PCB高密度集成。封装材料耐高温（峰值260℃以内），兼容回流焊工艺，满足量产焊接可靠性要求。
四、典型应用场景
结合高频性能与小封装，该电感主要用于：
- 无线通信设备：手机、平板的WiFi（2.4GHz/5GHz）、蓝牙、NFC模块的天线匹配、滤波器、巴伦电路；
- 便携式电子：智能手表、蓝牙耳机的射频前端，利用小封装节省空间；
- 高频振荡电路：局部振荡器（LO）、压控振荡器（VCO）的电感元件，保证振荡信号纯度；
- 射频测试设备：小型信号发生器、频谱分析仪的高频匹配电路。
五、产品优势与价值
- 小型化集成：0201封装适配电子设备“轻薄化”趋势，节省PCB空间；
- 高频性能优异：高Q值与6.8GHz SRF覆盖主流无线频段，满足低损耗需求；
- 低损耗设计：400mΩ DCR减少直流损耗，提升电池设备续航；
- 品牌可靠性：顺络电感一致性好、可靠性高，满足量产品质要求；
- 工艺兼容：适配SMT回流焊，与其他贴片元件集成度高，降低生产难度。
该电感平衡了“尺寸、性能、成本”，是消费电子、无线通信领域射频电路的优选元件之一。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
