WMSIC Electronic Components

Sunlord SDNT1005X103F3435FTF

ModelSDNT1005X103F3435FTF
Package0402
BrandSUNLORD
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Sunlord SDNT1005X103F3435FTF
Type
SUNLORD
Minimum package
10000 编带

Technical parameters

Power
100mW
Electronic Component
Electronic Component
Electronic Component
SUNLORD
Electronic Component
SDNT1005X103F3435FTF
Electronic Component
1
Electronic Component
0.5mm
Package
0402
Electronic Component
NTCThermistor Resistor
Electronic Component
0.019g
Electronic Component
1mm
Electronic Component
10kΩ
Electronic Component
0.5mm
Electronic Component
1
B
±1%
Electronic Component
BM0227580306
Operating Temperature
55℃~+125℃

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SDNT1005X103F3435FTF 产品概述

一、产品简介

SDNT1005X103F3435FTF 是顺络(Sunlord)推出的一款高精度贴片型 NTC 热敏电阻,封装为 0402(1.0 × 0.5 × 0.5 mm)。标准阻值 10 kΩ(25℃),阻值公差 ±1%,B 值(25℃/50℃)为 3435 K,B 值公差 ±1%。小体积与高精度相结合,适合移动设备、便携仪器及需要高密度组装的电子产品中做温度检测与补偿。

二、主要技术参数

  • 阻值:10 kΩ(25℃)
  • 阻值精度:±1%
  • B 值(25℃/50℃):3435 K,精度 ±1%
  • 最大稳态电流(25℃):310 μA
  • 额定功率:100 mW(静态)
  • 工作温度范围:-55℃ ~ +125℃
  • 耗散系数(热耗散系数):1 mW/℃
  • 热时间常数:3 s
  • 尺寸(L×W×H):1.0 × 0.5 × 0.5 mm(0402)

三、性能亮点

  • 高精度:±1% 阻值与 ±1% B 值精度,减少系统校准次数,提高温度测量精度。
  • 小型化:0402 封装,利于高密度 PCB 设计与空间受限应用。
  • 快速响应:热时间常数约 3 s,可满足多数温度监测的响应需求。
  • 宽温区稳定性:工作温度覆盖 -55℃ 至 +125℃,适配工业级环境。

四、热与电气使用建议

  • 最大稳态电流 310 μA 在 25℃ 对应的电压约为 3.1 V(V = I·R),此时消耗功率约 0.96 mW,接近 1 mW 的耗散系数所致的 1℃ 温升。为避免自热带来的测量误差,推荐测量电流显著低于额定最大值(例如 ≤ 30 μA)或采用脉冲测量法。
  • 在设计测量电路时,常用恒流源或分压 + ADC 结构;若要求高精度,建议采用恒流源配合差分测量或校准算法。
  • 温度到阻值的转换可使用 B 参数公式或 Steinhart–Hart 近似:
    1/T = 1/T0 + (1/B) ln(R/R0)(T 单位为 K)。

五、典型应用场景

  • 手机、平板等消费类终端的环境温度监测与充电温控。
  • 可穿戴设备与小型医疗器械中对温度进行实时采样。
  • 电源管理、锂电保护板的电池温度检测与补偿。
  • 工业控制中作为温度补偿元件或温度触发元件。

六、封装与焊接注意事项

  • 0402 封装体积小,贴装与焊接需使用精密贴片设备与合理回流曲线,避免过高的预热与回流峰值温度集中;参考无铅回流曲线并遵循厂家焊接说明。
  • 机械应力对小型元件影响较大,焊盘设计时注意过孔与铜厚分布,避免在元件下方产生热梯度或应力集中。
  • 清洗与烘烤:焊后如需清洗,选用对元件安全的溶剂;长时间存放或受潮后请根据潮湿敏感级别(MSL)进行预烘烤。

七、可靠性与测试

  • 推荐在最终产品中进行温度校准以补偿封装与系统误差。
  • 精度验证可用恒温槽配合精密电阻计或四线测量仪器进行逐点测量。
  • 关注长期漂移与循环热应力试验(温度循环、热冲击)对阻值稳定性的影响,必要时与供应商确认可靠性认证数据。

总结:SDNT1005X103F3435FTF 是一款适合高精度、小型化应用的 NTC 热敏电阻,凭借 ±1% 的高精度与 0402 的小封装,在移动终端、电源管理与精细温控场景中具有显著优势。设计时需特别注意自热控制、焊接工艺及系统级校准,以发挥其最佳性能。

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