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Sunlord SDCL1005C4N7STDF
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- Sunlord SDCL1005C4N7STDF
- Type
- SUNLORD
- Minimum package
- 10000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- SUNLORD
- Electronic Component
- SDCL1005C4N7STDF
- Electronic Component
- 1
- Package
- 0402
- Type
- Inductor
- Electronic Component
- SMD Inductor
- Electronic Component
- 0.019g
- Inductor
- 4.7nH
- Electronic Component
- 1
- Factor
- 8@100MHz
- Electronic Component
- BM0257689706
- Current
- 300mA
- Frequency
- 4GHz
- Resistor(DCR)
- 200mΩ
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
SDCL1005C4N7STDF 产品概述
一、产品简介
SDCL1005C4N7STDF 为顺络（Sunlord）0402 封装叠层贴片电感，标称电感值为 4.7 nH。该器件针对高频应用优化，具有自谐振频率高达 4 GHz 的特性，适合在射频匹配、滤波与高频去耦场合使用。体积微小，便于高密度 PCB 设计与自动化贴装。
二、主要参数
- 电感值：4.7 nH
- 额定直流电流：300 mA（最大工作电流）
- 直流电阻（DCR）：200 mΩ
- 品质因数（Q）：8 @ 100 MHz
- 自谐振频率（SRF）：4 GHz
- 类型：叠层电感（Multilayer）
- 封装：0402（约 1.0 × 0.5 mm）
三、特性与优点
- 小体积、高频性能良好：0402 封装、SRF 高，适合到 GHz 级应用。
- 可靠的直流电流承载能力：300 mA 满足多数小信号及偏置网络需求。
- 稳定性与一致性：叠层制造工艺保证电感值及阻抗一致性，便于批量生产。
- 贴片工艺兼容：支持回流焊与常规 SMT 工艺，适合自动贴装与高速生产线。
四、典型应用场景
- 射频匹配网络与谐振电路（移动通信、无线模块）
- 高频去耦与阻抗隔离（天线馈线、射频前端）
- 滤波器与陷波器电路中的小值电感
- PCB 上对高速信号线的阻抗调节与共模/差模策略配合
五、封装与安装建议
- 推荐短且粗的走线连接，减小附加寄生电感与电阻。
- 贴装位置应避免与热源直接接触，确保焊接质量并减少热应力。
- 对于射频路径，器件应靠近信号源或负载布置以减少走线感抗影响。
- 建议采用卷带（tape & reel）供料，配合常规 0402 阶段回流曲线焊接。
六、出货与可靠性
- 适用于工业级电子产品的长期稳定工作，叠层结构具有良好机械强度。
- 建议在设计验证阶段进行实际电路板上的温升与频率响应测试，确认在目标环境下的性能。
七、选型注意事项
- 直流电阻较高（200 mΩ），在对功耗敏感的应用中需评估能量损耗与温升。
- 当工作频率接近或超过 SRF（4 GHz）时，电感特性会明显变化，应以网络分析仪测量实板性能为准。
- 若需更高 Q 值或更大电流等级，可考虑同厂更大尺寸或不同工艺的产品系列。
如需器件封装图、频率响应曲线或 PCB 推荐焊盘尺寸，可提供具体资料或联系顺络技术支持获取详尽数据手册。
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