Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
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Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
SDCL1005C56NJTDF 是顺络(Sunlord)推出的一款贴片电感,封装尺寸为 0402,标称电感值 56 nH,公差 ±5%,额定直流电流 200 mA。该器件直流电阻(DCR)约为 1.2 Ω,在 100 MHz 时品质因数 Q≈8,自谐振频率(SRF)约为 750 MHz。小体积与较高谐振频率使其适用于空间受限且对高频特性有要求的电路。
由于较高的 DCR,SDCL1005C56NJTDF 在需要低损耗传输的电源线或大电流路径中并不理想;但其 56 nH 的电感量与 750 MHz 的 SRF 使其适用于射频滤波、阻断高频干扰、通带外抑制及偏置网络中的扼流应用。典型应用包括射频前端滤波、终端匹配、EMI 抑制以及便携式 / IoT 设备的射频通道滤波元件。
0402 小封装需注意贴装工艺:推荐使用无铅回流焊,遵循厂方回流温度曲线并控制焊膏量以避免焊接应力。焊盘设计应参考顺络推荐的焊盘尺寸与锡膏模板,以保证良好焊接可靠性。为避免过热导致特性漂移,设计时应考虑器件热阻与散热路径。
若电路对直流压降和功耗敏感,应优先选择 DCR 更低、额定电流更高的更大尺寸电感(如0603/0805)。反之若空间受限且主要目标是高频抑制,SDCL1005C56NJTDF 是较合适的选择。选型时还应关注 S 参数或阻抗-频率曲线以匹配工作频段。
器件符合常规表面贴装元件的可靠性要求,建议干燥包装保存,避免长期潮湿暴露;在贴装前遵循湿敏等级(MSL)回流前烘烤要求。避免超出额定电流和回流温度,以保证长期稳定性与寿命。
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Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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