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Sunlord SDCL1005C2N4STDFM01
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- Sunlord SDCL1005C2N4STDFM01
- Type
- SUNLORD
- Minimum package
- 10000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- SUNLORD
- Electronic Component
- SDCL1005C2N4STDFM01
- Electronic Component
- 1
- Package
- 0402
- Type
- Inductor
- Electronic Component
- SMD Inductor
- Electronic Component
- 0.019g
- Inductor
- 2.4nH
- Electronic Component
- 1
- Factor
- 8@100MHz
- Electronic Component
- BM0264913668
- Current
- 850mA
- Frequency
- 6GHz
- Resistor(DCR)
- 200mΩ
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
SDCL1005C2N4STDFM01 叠层高频电感产品概述
SDCL1005C2N4STDFM01是顺络电子（Sunlord）针对高频射频电路推出的0402封装（公制1005）叠层电感，兼顾小尺寸、高精度与低损耗特性，可满足消费电子、无线通信等领域的小型化、高性能需求，是射频前端、无线模块设计的核心组件之一。
一、核心电气参数解析
该电感的参数设计精准匹配高频应用场景，关键指标如下：
- 电感值：标称2.4nH，公差±0.3nH（±12.5%范围），满足射频电路阻抗匹配、信号滤波的精度要求；
- 额定电流：300mA（直流），可稳定承载常规射频电路工作电流，避免电感饱和导致性能下降；
- 直流电阻（DCR）：200mΩ（典型值），低DCR设计减少直流功耗，提升电路效率；
- 封装尺寸：0402英制（1.0mm×0.5mm公制），厚度约0.5mm，适配高密度PCB布局。
二、封装与工艺特点
采用陶瓷叠层工艺制造，核心优势体现在：
- 高频特性优异：陶瓷基片低介电损耗+叠层结构低寄生参数，在1GHz~6GHz频段内电感特性稳定，适配5G Sub-6G、WiFi 6E等高频场景；
- 小型化高密度：0402封装是当前小型化设备主流封装，可显著降低PCB占用面积，适配智能手机、可穿戴设备；
- 可靠性强：陶瓷材料耐温范围宽（-40℃~+85℃），无引线叠层结构抗振动/冲击，满足工业级与消费级产品可靠性要求。
三、性能优势与价值
该电感的性能设计解决了高频电路的核心痛点：
- 低损耗：1GHz频段Q值约30（品质因数），减少信号传输损耗，提升射频链路效率；
- 精度稳定：±0.3nH公差在叠层电感中属于较高精度，避免阻抗匹配偏差，提升电路一致性；
- 工艺兼容：支持回流焊，与常规PCB制造流程兼容，便于批量生产。
四、典型应用场景
广泛覆盖高频通信与消费电子领域：
- 5G/4G移动终端：智能手机、平板的射频前端（LNA/PA匹配、天线调谐），适配Sub-6G频段；
- 无线音频设备：蓝牙5.3 TWS耳机的天线模块、音频芯片电源滤波；
- IoT与可穿戴：智能手表、智能家居传感器的WiFi/蓝牙模块，满足小型化需求；
- 通信子系统：小型宏站、微站的射频收发单元，用于信号滤波与阻抗调节。
五、总结
SDCL1005C2N4STDFM01通过陶瓷叠层工艺实现了小尺寸、高精度与低损耗的平衡，支撑5G、WiFi 6等新一代技术的小型化落地，是消费电子、无线通信领域高频电路设计的优选组件。
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