WMSIC Electronic Components

Sunlord SZ1608K252TF

ModelSZ1608K252TF
Package0603
BrandSUNLORD
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Sunlord SZ1608K252TF
Type
0603
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
SUNLORD
Electronic Component
SZ1608K252TF
Electronic Component
1
Package
0603
Electronic Component
Ferrite Bead
Electronic Component
±25%
Electronic Component
0.027g
Electronic Component
1
Channel Count
1
Electronic Component
BM0264536377
Operating Temperature
55℃~+125℃
Current
200mA
@Frequency
2.5kΩ@100MHz
Resistor(DCR)
1.2Ω
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

顺络SZ1608K252TF 片式磁珠产品概述

一、核心参数规格

顺络SZ1608K252TF是一款针对100MHz频段EMI抑制设计的片式磁珠,核心参数如下:

  • 阻抗特性:2.5kΩ(误差±25%)@100MHz(精准匹配常见干扰频段的衰减需求)
  • 直流电阻(DCR):1.2Ω(低电阻设计,减少自身功率损耗与发热)
  • 额定电流:200mA(适用于低功耗电路的电流承载能力)
  • 通道数:1(单通道结构,贴装简单且兼容性强)
  • 工作温度范围:-55℃至+125℃(宽温覆盖工业级与部分车载环境)
  • 封装形式:SZ1608封装(对应英制0603/公制1.6×0.8mm,小型化适配高密度PCB)
  • 品牌:Sunlord(顺络电子,国内片式磁珠领域龙头,可靠性行业认可)

二、设计特点与工艺

该磁珠采用顺络成熟的铁氧体材料与多层片式工艺,核心设计优势包括:

  1. 高频阻抗精准优化:针对100MHz频段的EMI干扰特性,通过材料配方调整实现阻抗曲线的精准匹配,在目标频段提供高阻抗以衰减干扰信号;
  2. 低DCR与小型化平衡:在0603封装下实现1.2Ω低DCR,既保证干扰抑制效果,又避免因电阻过大导致的功率损耗;
  3. 多层共烧工艺:确保磁珠结构稳定,批量生产时参数偏差可控在±25%以内,一致性优异;
  4. 端电极适配性:采用镍锡(Ni/Sn)端电极,兼容回流焊、波峰焊等贴装工艺,适配无铅制程,焊接可靠性高。

三、主要应用场景

SZ1608K252TF主要用于低功耗电子设备的电磁干扰抑制,典型应用包括:

  1. 消费电子:智能手机、平板电脑的射频(WiFi/蓝牙)模块、数字信号处理电路滤波,减少电路间电磁耦合;
  2. 通信设备:小型基站、无线AP的电源与信号滤波,抑制100MHz左右谐波干扰;
  3. 工业控制:低功耗传感器节点、小型PLC控制器的电源线路滤波,保障信号传输稳定性;
  4. 物联网设备:智能穿戴(手表/手环)、智能家居设备的无线模块滤波,提升信号抗干扰能力;
  5. 车载辅助电子:部分低功耗车载模块(如胎压监测、车内传感器)的滤波(宽温范围适配车载环境)。

四、性能优势分析

  1. 干扰抑制效率高:100MHz频段2.5kΩ高阻抗,可有效衰减共模/差模干扰,降低电路EMI emissions;
  2. 低损耗设计:1.2Ω低DCR减少自身发热,适合长期连续工作的低功耗电路;
  3. 宽温可靠性:-55℃至+125℃工作温度,覆盖工业级与部分车载场景,环境适应性强;
  4. 小型化贴装:0603封装体积小(1.6×0.8mm),适配高密度PCB设计,贴装效率高、成本可控;
  5. 品牌可靠性:顺络产品经过严格可靠性测试(高低温循环、振动、冲击等),一致性与稳定性行业领先。

五、应用注意事项

  1. 电流匹配:工作电路最大电流需≤200mA,避免磁珠饱和或失效;
  2. 频率匹配:主要针对100MHz频段干扰,若需抑制其他频段需选择对应频率点磁珠;
  3. 焊接工艺:无铅回流焊需遵循顺络推荐曲线(峰值245±5℃,时间≤10s),避免损坏磁珠;
  4. 存储条件:建议存储于25±5℃、湿度30%~70%环境,开封后尽快使用,防止端电极氧化。

该产品凭借高阻抗、低损耗、宽温特性,成为低功耗电子设备EMI抑制的高性价比选择,广泛适配消费电子、通信、工业等领域的小型化设计需求。

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