WMSIC Electronic Components

Sunlord MPL1608S1R0MHT

ModelMPL1608S1R0MHT
Package0603
BrandSUNLORD
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Sunlord MPL1608S1R0MHT
Type
SUNLORD
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
SUNLORD
Electronic Component
MPL1608S1R0MHT
Electronic Component
1
Package
0603
Type
Inductor
Electronic Component
SMD Inductor
Electronic Component
±20%
Electronic Component
0.027g
Inductor
1uH
Electronic Component
1
Electronic Component
BM0258491392
Current
950mA
Frequency
75MHz
Resistor(DCR)
200mΩ
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MPL1608S1R0MHT 产品概述

一、主要参数

  • 型号:MPL1608S1R0MHT(顺络 Sunlord)
  • 封装:0603(1608公制)
  • 类型:叠层贴片电感(Multilayer Chip Inductor)
  • 标称电感:1.0 μH
  • 公差:±20%
  • 额定电流:950 mA
  • 直流电阻(DCR):200 mΩ
  • 自谐振频率(SRF):约 75 MHz
  • 封装及包装:SMT 贴片,常见带卷包装,符合 RoHS 要求(详见厂方资料)

二、产品特点

  • 体积小、适合集成:0603 封装适合高密度贴片设计,适用于便携式与空间受限的电路板。
  • 通用功率滤波:1 μH ±20% 属于通用型感值,适配常见电源滤波与去耦场景。
  • 中等直流损耗:200 mΩ 的 DCR 在接近额定电流下会产生一定的功耗(见下),需考虑热管理与电流余量。
  • 高频特性:SRF ≈ 75 MHz,器件在此频率附近开始出现寄生电容影响,适用于 MHz 级以下的电源与 EMI 滤波应用。

三、性能参考与计算

  • 交流阻抗参考:XL = 2πfL
    • f = 1 MHz 时 XL ≈ 6.28 Ω
    • f = 10 MHz 时 XL ≈ 62.8 Ω
  • 直流功耗(在额定电流):
    • P = I^2·R = (0.95 A)^2 × 0.2 Ω ≈ 0.18 W(约 180 mW),说明在长时间高负载下会有显著发热,应做电流余量或散热管理。
  • 频率使用建议:感性工作区间在 SRF 低于 75 MHz 时有效,若在高频段使用需评估寄生电容影响及阻抗曲线。

四、应用场景

  • DC-DC 降压/升压转换器的输入/输出滤波与去耦
  • 电源线与信号线的 EMI 抑制
  • 模拟前端或基带电路的低频滤波
  • 便携设备、通信终端、电源管理模块等空间受限场合

五、PCB 布局与焊接建议

  • 焊盘尺寸与焊膏量请参考顺络推荐的 0603 贴片封装 land pattern,以保证焊接可靠性与热传导。
  • 尽量使电感与被滤波器件(如电容、芯片)距离最短,以减小环路面积和寄生感抗。
  • 焊接工艺遵循厂方推荐回流曲线(参考 J-STD-020),避免超温或反复回流导致性能漂移。
  • 高电流场合建议增加铜箔厚度或加大过孔以改进散热。

六、选型与使用注意

  • 若需更低温升或更高稳定电感,建议选用 DCR 更低或额定电流更高的产品,或选择更大封装型号。
  • 长期连续工作应考虑 70% 左右的电流去率(即持续电流建议低于额定值的 60–80%),以延长寿命并保持电感特性。
  • 在关键射频或高频滤波场合,应参考厂方的阻抗/频率曲线及 S 参数以确认性能符合要求。

如需器件的详细频率响应、温升曲线、封装图纸及回流焊工艺参数,建议下载顺络官方 datasheet 或联系当地技术支持获取完整资料。

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