WMSIC Electronic Components

Sunlord WPN252010H1R5MT

ModelWPN252010H1R5MT
Package1008
BrandSUNLORD
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Sunlord WPN252010H1R5MT
Type
SUNLORD
Minimum package
2000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
SUNLORD
Electronic Component
WPN252010H1R5MT
Electronic Component
1
Package
1008
Electronic Component
Power Inductor
Electronic Component
±20%
Electronic Component
0.008g
Inductor
1.5uH
Electronic Component
1
Electronic Component
BM0257715550
Current
2A
Resistor(DCR)
106mΩ
Electronic Component
Electronic Component
Electronic Component
2000
and Current(Isat)
2.6A

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

WPN252010H1R5MT 产品概述

一、产品简介

WPN252010H1R5MT 为顺络(Sunlord)系列功率电感,额定电流 2A,标称电感 1.5µH,公差 ±20%,封装 1008(对应 2520 尺寸,约 2.5×2.0mm)。该器件为面贴功率电感,适用于空间受限的中低功率开关电源及滤波场合,具有较高的饱和电流和适配表面贴装工艺的结构。

二、主要电气参数

  • 电感值:1.5µH(±20%)
  • 额定电流(Irated):2A
  • 饱和电流(Isat):2.6A(接近此电流时电感会显著下降)
  • 直流电阻(DCR):≈106mΩ(0.106Ω)
  • 封装:1008(2520)表面贴装

示例功耗(用于热设计参考):当流经 2A DC 时,铜损 P = I^2·DCR ≈ 2^2×0.106 ≈ 0.424W — 需考虑温升与散热路径。

三、特性与优势

  • 小尺寸:1008/2520 封装适合高密度 PCB 布局与移动设备。
  • 中等电流能力:2A 额定,2.6A 饱和,适合 0.5–2A 级别的降压转换器或滤波用途。
  • 便于自动贴装、回流焊接,利于批量生产。
  • 较高 DCR 提示在设计中应权衡效率与体积:体积小但损耗相对较高,适用于对效率要求不过分苛刻且空间有限的应用。

四、典型应用

  • 降压(Buck)开关稳压器输入/输出电感(中小功率)
  • LED 驱动、电池供电模块的滤波与储能
  • 器件旁路与 EMI 抑制
  • 移动终端、便携设备、物联网节点的电源管理

五、使用与选型建议

  • 饱和裕度:建议工作电流保持在 Isat 的 60%~80% 以下(例如 ≤2.0A),以避免电感量显著下降导致输出纹波增大或控制环不稳定。
  • 考虑 DCR:若效率为关键指标,应选择 DCR 更小或体积稍大的功率电感以降低损耗;同时可评估是否需要并联元件或改变拓扑以减小平均电流。
  • 纹波电流与频率匹配:电感损耗除 DCR 外还与开关频率有关,选型时参考器件在目标频率下的铁损曲线或实际测量数据。
  • 公差影响:±20% 公差在紧密电源设计中会影响输出纹波与瞬态性能,必要时在设计中留裕量或选用更严格公差型号。

六、封装与焊接注意事项

  • 推荐采用标准回流焊曲线,避免过高峰值温度和长时间高温暴露以保护磁芯材料与粘接。
  • PCB 布局建议:将电感靠近开关器件与输出电容放置,缩短高电流环路,增加散热铜箔面积与过孔以降低温升。
  • 焊盘尺寸按厂商推荐图纸设计,避免焊接应力导致器件机械损伤。

七、可靠性与测量要点

  • 进行实际工作点的电感测量(带直流偏置)以确认在工作电流下的实际电感值与损耗。
  • 做温升试验:在最大额定电流和典型工作环境下测试温升,确认不超过系统热预算。
  • 关注长期老化与循环应力,特别是在振动或极端温度环境下的可靠性需求。

总结:WPN252010H1R5MT 适合体积受限且需中等电流能力的电源与滤波场合,在选型时应综合考虑 DCR 带来的功耗、饱和电流裕度与电感公差对系统性能的影响,并做好热管理与 PCB 布局。若需更详细的封装尺寸、回流曲线或频率相关损耗数据,建议参考顺络官方器件数据手册。

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