Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
SGMICRO SGM809-TXN3L/TR SGM809
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- SGMICRO SGM809-TXN3L / TR
- Type
- SGMICRO
- Unit
- Electronic Component
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- SGMICRO
- Electronic Component
- SGM809-TXN3L/TR
- Electronic Component
- 1
- Package
- SOT-23
- Electronic Component
- Supervisorand positions IC
- Electronic Component
- 0.039g
- Electronic Component
- 1
- Electronic Component
- BM0000002694
- Reset
- 240ms
- Operating Temperature
- 40℃~+125℃
- Operating Voltage
- 1V~5.5V
- Output Type
- Electronic Component
- Voltage
- 3.08V
- Static Current(Iq)
- 13uA
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
产品概述：SGM809-TXN3L/TR 监控和复位芯片
SGM809-TXN3L/TR是一款由圣邦微（SGMICRO）推出的高性能监控和复位芯片，适用于需要精确监控电压水平以及自动复位的各种电子设备。这款芯片通过推挽输出的方式进行操作，具备低电平有效的特性，能够在多种应用条件下提供可靠的性能。
1. 技术特点
SGM809系列芯片的一个显著特征是其3.08V的电压监测点，适合广泛使用在各种3.3V系统中。这使其成为桌面计算机、嵌入式系统、工业控制等电力监控领域的理想选择。芯片采用了SOT-23封装，具有体积小、散热性能优越等特点，非常适合空间有限且对元器件布局有要求的电路设计。
2. 工作原理
SGM809的基本工作原理是监测电源电压并在电压低于设定值时发出复位信号。芯片的工作状态通过推挽输出（Push-Pull Output）实现，此方式可以确保输出信号的快速翻转，有效降低了外部元器件的数量。此外，其低电平有效的特点使得系统在电压下降时能够迅速响应，保障设备的稳定运行。
当电源电压降低至阈值以下时，SGM809会将输出引脚拉低，从而触发复位，将微控制器或其他逻辑电路的状态重置，确保系统不会因为电源不稳定而导致意外行为。这种设计在确保用户最终产品的可靠性与安全性方面至关重要，尤其是在对电源质量要求严格的应用场景。
3. 应用领域
SGM809-TXN3L/TR芯片主要应用于以下几个领域：
- 计算机与网络设备：在PC主板、路由器、交换机等设备中进行电源监控和复位管理，确保系统在电源异常时能够进行自我保护和恢复。
- 家用电子设备：如电视机、音响等，在电源供应不稳定时，通过监控电流的状态及时复位，维护设备性能稳定。
- 工业控制系统：应用于PLC、传感器等设备的监控与复位，保障生产线的高效运作，避免因电压问题造成的生产停滞。
- 便携式设备：由于该芯片具备小型化特性，非常适合各种便携式设备中使用，例如手持终端、便携式探测器等。
4. 性能优势
- 小型化设计：SOT-23封装使得SGM809具有较高的集成度，节省了PCB空间，便于在复杂电路板上布局。
- 高精度和可靠性：芯片具有优秀的电压监控精度，能够有效地识别电压变化，从而确保系统的高可靠性。
- 快速响应：得益于推挽输出设计，芯片能够在电源状态发生变化时快速反应，避免了因延迟造成的潜在问题。
- 低功耗：SGM809在工作时耗电量极低，适合长时间运行的嵌入式或便携设备，提升了产品的续航能力。
5. 结论
SGM809-TXN3L/TR以其优越的电源监控能力、稳定的复位输出及小巧的封装设计，成为现代电子设备中不可或缺的重要组成部分。其在多种应用场合的灵活性和高效性，使其在行业中拥有广泛的市场前景。该芯片的采用不仅能够提升设备的整体性能，也能有效延长其使用寿命，因此对于设计师和开发者而言，是一个值得考虑的优质选择。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
