WMSIC Electronic Components

SGMICRO SGM8270-2XMS8G/TR SGM8270

ModelSGM8270-2XMS8G/TR
PackageMSOP-8
BrandSGMICRO
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
SGMICRO SGM8270-2XMS8G / TR
Type
SGMICRO
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
SGMICRO
Electronic Component
SGM8270-2XMS8G/TR
Electronic Component
1
Package
MSOP-8
Electronic Component
Operational Amplifier
Electronic Component
0.12g
Electronic Component
1
Electronic Component
Output
Electronic Component
BM0228535023
Operating Temperature
40℃~+125℃
Amplifier
2
Output Current
40mA
(SR)
8V/us
Power Supply Voltage
3.3V~36V
Static Current(Iq)
1mA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SGM8270-2XMS8G/TR 产品概述

SGM8270-2XMS8G/TR 是圣邦微(SGMICRO)推出的双通道轨到轨运算放大器,针对低功耗、宽电源电压和高精度前端设计需求优化。器件在保证低静态电流的同时提供良好的带宽、噪声和驱动能力,适合便携式、工业和汽车电子等多种场景。

一、主要特性

  • 双通道运算放大器(MSOP-8 封装)
  • 轨到轨输入与轨到轨输出(Rail-to-Rail I/O)
  • 增益带宽积(GBP):2.5 MHz
  • 压摆率(SR):8 V/µs
  • 单通道静态电流(Iq):约 1 mA
  • 单电源工作范围:3.3 V 至 36 V;双电源范围:±18 V(最大电源差 36 V)
  • 输出峰值驱动能力:可达 40 mA
  • 输入失调电压(Vos):典型 2.8 mV;温漂 800 nV/°C
  • 输入偏置电流(Ib):300 pA;输入失调电流(Ios):300 pA
  • 噪声密度:15 nV/√Hz @ 1 kHz
  • 共模抑制比(CMRR):105 dB
  • 工作温度范围:-40 ℃ 至 +125 ℃

二、性能亮点与应用价值

  • 低功耗与宽电压:1 mA 的静态电流配合 3.3 V—36 V 宽电源,适用于电池供电和工业供电系统。
  • 高精度前端:低失调、低漂移和低噪声使其适合模拟传感器前端、差分放大、仪表放大器级联等高精度测量场合。
  • 良好驱动能力:40 mA 的输出电流可直接驱动中等负载,适合驱动小型执行器或低阻抗转换器。
  • 轨到轨 I/O:在低电压环境下也可实现最大信号摆幅,利于提高系统动态范围并简化电源设计。
  • 宽温度范围:-40 ℃ 至 +125 ℃ 满足汽车级或严苛工业温度要求。

三、典型应用场景

  • 传感器接口与信号调理(温度、压力、流量等高阻抗传感器)
  • 低通/带通有源滤波、积分/微分电路、AGN 放大模块
  • ADC 驱动与采样保持电路
  • 电源管理与电池监测
  • 工业控制与汽车电子(需确认具体车规认证)

四、封装与布局建议

  • 封装:MSOP-8,适合空间受限的 PCB 布局。
  • 电源旁路:建议在 Vdd/Vss 电源引脚附近放置 0.1 µF 陶瓷旁路电容,并配合 1 µF 以上低频电容以抑制电源噪声。
  • 输入保护:若可能接触高压脉冲或电磁干扰,应在输入端增加限流电阻与TVS或串联小电容,保护输入级并保证共模范围内工作。
  • 负载容性:若驱动较大电容负载,建议在输出与负载间串联小阻(10–50 Ω)以保证稳定性并减少超调。

五、设计注意事项

  • 虽支持轨到轨 I/O,但在大摆幅或高输出电流下,输出接近电源轨时可能有线性限幅,应根据系统需求留有裕量。
  • 高频性能力有限(GBP 2.5 MHz),不适用于高带宽高精度运算放大需求;适合中低速信号调理与滤波。
  • 在高温或高电压应用中,请按完整规格书确认最大功耗与封装热阻,必要时采取散热措施。

总结:SGM8270-2XMS8G/TR 综合了低噪声、低偏流、轨到轨 I/O 与宽电源电压等特性,是面向多种工业与便携式信号调理应用的高性价比双路运放选择。欲获取详细电气特性曲线与典型应用电路,请参考官方数据手册。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.