WMSIC Electronic Components

SGMICRO 74AHC595XTS16G/TR 74AHC595XTS16G

Model74AHC595XTS16G/TR
PackageTSSOP-16
BrandSGMICRO
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

15 specifications

Core information

Product name
SGMICRO 74AHC595XTS16G / TR
Type
SGMICRO
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
SGMICRO
Electronic Component
74AHC595XTS16G/TR
Electronic Component
1
Package
TSSOP-16
Electronic Component
positions Register
Electronic Component
0.18g
Electronic Component
1
Features
Output
Electronic Component
BM0257247754
Electronic Component
Electronic Component
Electronic Component
4000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

74AHC595XTS16G/TR 产品概述

一、产品概述

74AHC595XTS16G/TR 是圣邦微(SGMICRO)提供的一款常用 8 位串入并出移位寄存器,封装为 TSSOP-16。该器件属于 AHC(Advanced High-speed CMOS)系列,兼顾高速与低功耗,适合微控制器扩展 I/O、LED 驱动和串并转换等场景。器件集成了移位寄存、锁存和三态并行输出,支持级联使用,便于扩展输出数目。

二、主要功能特性

  • 异步清零(SRCLR):可对移位寄存器进行异步清零,通常为低有效信号,便于快速复位输出状态。
  • 输出使能(OE):并行输出带三态控制,OE 通常为低有效,高电平可将并行输出置为高阻,便于总线共享与热插拔控制。
  • 串入并出:支持串行数据输入并输出并行数据,且带有串行输出(QH')用于级联另一个 74AHC595。
  • 锁存功能:独立的锁存时钟(RCLK)用于将移位寄存器数据传送到并行输出寄存器,实现数据的同步刷新。
  • TSSOP-16 封装,利于 PCB 集成与密度控制。

三、引脚与信号说明(简要)

  • SER(DS):串行数据输入。
  • SRCLK(SH_CP):移位时钟,边沿触发移位操作。
  • RCLK(ST_CP):锁存时钟,将移位寄存器内容传到并行输出。
  • SRCLR:移位寄存器异步清零(低有效)。
  • OE:输出使能(低有效),高电平时并行输出为高阻。
  • Q0–Q7:并行输出口(八位)。
  • QH':串行数据输出,可直接连接下一级器件以实现级联。
  • VCC、GND:电源引脚。

四、典型应用场景

  • MCU/FPGA I/O 扩展:用少数 SPI/控制线扩展并行输出口。
  • LED/指示灯驱动:通过并行输出直接驱动小功率 LED(建议串联限流电阻)。
  • 数码管/矩阵驱动(与驱动器配合)。
  • 继电器/小功率负载的控制(建议外接驱动或缓冲级)。
  • 多字节数据串联传输与存储。

五、使用与电路设计建议

  • 电源去耦:VCC 与 GND 之间靠近器件放置 0.1 µF 陶瓷电容,抑制瞬态噪声。
  • SRCLR 与 OE:若不使用复位或输出控制,建议通过上拉/下拉电阻将其拉到默认非激活电平(SRCLR 拉高,OE 拉低),避免上电不定态。
  • LED 驱动:Q 输出为 CMOS 推挽,直驱 LED 时需串联限流电阻;大电流负载应加外部驱动器或缓冲。
  • 级联连接:将前级 QH' 连接至后级 SER,同时共享 SRCLK 与 RCLK,可实现任意位宽扩展。
  • 电平兼容:若控制器电压与器件不一致,请注意电平匹配或加电平移位。
  • 布局注意:高速切换信号链路短且阻抗可控,避免长线路引入毛刺或时序问题;关注器件功耗与散热。

六、采购与资料

型号完整标识为 74AHC595XTS16G/TR,其中 “/TR” 常表示卷带(Tape & Reel)包装,便于自动贴片生产。器件封装为 TSSOP-16。建议在设计前查阅圣邦微官方数据手册以获取详细电气参数、时序图、功耗、温度范围及合规性信息,并参考生产商的推荐焊接与封装尺寸图。若用于关键或高可靠性场合,请向供应商确认供货批次与相关认证资料。

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