WMSIC Electronic Components

SGMICRO SGM2534BXTD10G/TR SGM2534BXTD10G

ModelSGM2534BXTD10G/TR
PackageTDFN-10L(3x3)
BrandSGMICRO
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
SGMICRO SGM2534BXTD10G / TR
Type
SGMICRO
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
SGMICRO
Electronic Component
SGM2534BXTD10G/TR
Electronic Component
1
Package
TDFN-10L(3x3)
Electronic Component
Power Electronic Switch
Electronic Component
0.11g
Electronic Component
1
Channel Count
1
Electronic Component
BM0227272021
Resistor
27mΩ
Operating Temperature
40℃~+125℃
Operating Voltage
4.5V~13.8V
Electronic Component
Electronic Component
Electronic Component
4000
Logic
Level

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SGM2534BXTD10G/TR 产品概述

一、产品简介

SGM2534BXTD10G/TR 是圣邦微(SGMICRO)推出的一款单通道功率开关器件,采用 TDFN-10L (3×3 mm) 小封装,面向需要低导通损耗和高可靠性的电源管理应用设计。输入控制为“高电平有效”,适配常见逻辑控制信号,工作温度范围宽(-40℃ 至 +125℃),适用于工业与消费类设备。

二、主要参数

  • 通道数:1 通道
  • 输入控制逻辑:高电平有效
  • 工作电压:4.5 V ~ 13.8 V
  • 导通电阻(RDS(on)):典型值 27 mΩ(实际依赖栅压与温度)
  • 工作温度:-40℃ ~ +125℃
  • 封装:TDFN-10L (3×3 mm)
  • 品牌:SGMICRO(圣邦微)

三、产品特性

  • 低导通电阻,降低功率损耗并提高转换效率;
  • 宽工作电压范围,兼容 5 V、12 V 等常见系统总线;
  • 宽温度等级,适应工业级环境;
  • 小体积封装,有利于紧凑 PCB 布局与空间受限的系统设计;
  • 高电平使能方式,易于与 MCU 或电源管理 IC 的 GPIO 配合。

四、典型应用

  • 电源管理与负载开关(如电池供电系统、背光、外围供电使能);
  • 热插拔保护、倒灌保护与电流限制场合;
  • 工业控制与通信设备中的功率分配;
  • 消费电子中需要低损耗开关的模块化电源设计。

五、封装与布局建议

TDFN-10L (3×3) 小封装对 PCB 散热与走线要求较高:

  • 建议在器件底部加焊大面积散热焊盘并通过多层过孔连接至内层/底层散热平面;
  • 输入/输出端应尽量缩短电源回流路径,增加铜厚以降低电阻与发热;
  • 在靠近器件的电源与地之间适当放置去耦电容,抑制瞬态电流冲击。

六、可靠性与使用注意

  • 工作温度与导通电阻呈正相关,需在高温条件下评估最大损耗与结温;
  • 依据系统最大电流计算器件功耗和热阻,保证结温不超过额定值;
  • 在有反向电流风险的场合,考虑并联二极管或采用带有回流保护的拓扑。

七、封装信息与订购

器件型号为 SGM2534BXTD10G/TR,封装 TDFN-10L (3×3)。在批量采购时,请确认产品批次、出货形式(卷带/管装)及相关存储与运输条件,必要时向供应商索取最新的器件规格书与可靠性测试报告。

若需进一步的电气特性曲线、典型应用电路或热仿真建议,可提供具体工作电流与系统拓扑以便给出更精确的设计指导。

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