WMSIC Electronic Components

SGMICRO SGM708-RYS8G/TR SGM708

ModelSGM708-RYS8G/TR
PackageSOIC-8
BrandSGMICRO
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 24+

Available for RFQ

Technical data

Product details

15 specifications

Core information

Product name
SGMICRO SGM708-RYS8G / TR
Type
SGMICRO
Minimum package
2500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
SGMICRO
Electronic Component
SGM708-RYS8G/TR
Electronic Component
1
Package
SOIC-8
Electronic Component
MCU(MCU / MPU / SOC)
Electronic Component
0.158g
Electronic Component
1
Features
(BOR / LVD / LVR / LVI); positions(POR); positions(NRST); positions(PDR)
Electronic Component
BM0227309263
Electronic Component
Electronic Component
Electronic Component
2500

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SGM708-RYS8G/TR 产品概述

一、产品简介

SGM708-RYS8G/TR 为圣邦微(SGMICRO)推出的微处理器监控与复位管理器,采用 SOIC-8 封装(RYS8G),/TR 表示卷带(Tape & Reel)包装。器件集成了多种复位与电压监测功能,专为提高微控制器(MCU/MPU)在上电、掉电与欠压情况中的可靠性而设计。

二、主要功能特性

  • 欠压检测(BOR/LVD/LVR/LVI):实时监测电源电压,当电压低于设定阈值时触发复位,防止微处理器进入不确定状态。
  • 上电复位(POR):在电源上电期间保持复位信号,直到电源稳定,确保系统能从定义的初始状态启动。
  • 外部管脚复位(NRST):提供外部强制复位输入/输出,便于人工或外围电路触发系统重启与故障处理。
  • 掉电复位(PDR):在电源下降时产生复位,避免在电压回落过程中 MCU 被错误唤醒或执行错误指令。
  • 低功耗与高可靠性设计,适合对稳定性要求较高的嵌入式系统。

三、典型应用场景

  • 工业控制与自动化设备:用于保护现场控制器在瞬态电源事件时的稳定性。
  • 消费类电子与智能家居:保证主控芯片在电源波动下的可靠上电和掉电行为。
  • 通信与网络设备:提高系统初始化与重启时的确定性,减少不稳定重启导致的问题。
  • 汽车电子与仪表(视产品工作温度等级与认证而定)。

四、封装与选型说明

  • 封装:SOIC-8(易于手工焊接与自动贴片,适配常见 PCB 布局)。
  • 包装:/TR 表示卷带包装,便于批量生产时的贴片和装配。
    选型时应确认目标系统的阈值、电压范围与工作温度是否与 SGM708 的规格匹配,并评估 NRST 电平与 MCU 复位输入的兼容性。

五、设计与使用建议

  • 在关键复位线添加适当的去耦与滤波网络,抑制瞬态干扰造成的误触发。
  • 将 NRST 与 MCU 的复位引脚直接连接,必要时通过开集电极/上拉结构实现兼容。
  • 在 PCB 布局阶段注意电源地与复位线的走向,以降低噪声耦合。
  • 结合厂商数据手册确认门限值、复位延时与电流参数,按需选择对应型号或外加电路以满足系统可靠性要求。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.