WMSIC Electronic Components

SGMICRO SGM6029BYG/TR SGM6029BYG

ModelSGM6029BYG/TR
PackageWLCSP-0.74×1.09-6B
BrandSGMICRO
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
SGMICRO SGM6029BYG / TR
Type
SGMICRO
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
SGMICRO
Electronic Component
SGM6029BYG/TR
Electronic Component
1
Package
WLCSP-0.74×1.09-6B
Electronic Component
DC-DC Power Supply IC
Electronic Component
0.021g
Electronic Component
1
Features
Output
Type
Electronic Component
Synchronous
Electronic Component
Electronic Component
BM0229465198
Operating Temperature
40℃~+85℃
Operating Voltage
1.95V~5.5V
Switching Frequency
4MHz
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SGM6029BYG/TR 产品概述

一、产品简介

SGM6029BYG/TR 是圣邦微(SGMICRO)推出的一款降压型 DC-DC 开关稳压器,采用降压拓扑并集成同步整流,工作电压范围 1.95V ~ 5.5V,开关频率高达 4MHz,工作温度范围 -40℃ ~ +85℃。单通道输出、超小 WLCSP-0.74×1.09-6B 封装,适合对体积和效率有严格要求的便携与物联网终端电源设计。

二、主要特点

  • 降压型同步整流架构:降低整流损耗,提升轻负载与重负载下的转换效率。
  • 宽输入电压:1.95V ~ 5.5V,兼容单节锂电池、两节并联电源或常见 5V 输入场景。
  • 高频工作:4MHz 开关频率,有利于使用体积更小的电感和输出电容,缩小整体方案尺寸。
  • 工业级温度范围:-40℃ ~ +85℃,适用于消费、工业和便携类应用场景。
  • 超小封装:WLCSP-0.74×1.09-6B,适合空间受限的产品设计。
  • 保护与可靠性:内置常见的保护功能(如过流保护、过温保护与启动控制),提高系统可靠性(具体保护行为请参考官方数据手册)。

三、典型应用

  • 可穿戴设备与智能手环
  • 物联网终端、电池供电传感器节点
  • 手机附件、蓝牙耳机与无线外设
  • 小型便携式仪器与模块化电源管理

四、封装与引脚(概述)

SGM6029BYG 为 6 引脚 WLCSP 封装(0.74×1.09 mm),带有最小化焊盘占位。典型功能引脚包括电源输入、开关节点、输出/反馈、使能/软启动、接地等。型号后缀 /TR 表示卷带包装(Tape & Reel),适合自动贴片生产。具体引脚定义与焊盘尺寸请参阅官方封装图和推荐焊盘布局。

五、设计与布局要点

  • 高频率下输入电容应紧靠 VIN 引脚放置,选用低 ESR 陶瓷电容(X5R/X7R)。
  • 开关结点(SW/LX)走线最短且远离敏感模拟信号,减小电磁干扰。
  • 输出电感与电容选型需兼顾稳定性与纹波要求,4MHz 允许使用小型功率电感。
  • 接地采用完整的铜平面并实现单点回流,散热能力有限时可在 PCB 下方铺铜加大散热面积。
  • 在布局和滤波设计上注意 EMI,要在必要位置加入 RC/LC 抑制网络并做好 PCB 屏蔽与接地。

六、选型与替代建议

选择时重点关注:最大输出电流、效率曲线(不同负载下)、启动行为(软启动/使能)及外部元件建议。若需更高电流或不同封装,可比较同系列或竞争厂商的同步降压器以满足功率与封装需求。

七、调试建议与常见问题

  • 如出现发热或效率较低,检查开关结点走线与电感发热;确认器件是否工作在连续/断续模式下。
  • 输出纹波过大可增大输出电容或优化电感值与电流纹波;输入侧加大去耦以抑制瞬态。
  • 发生启动失败或不稳定,检查使能脚/软启动配置及反馈网络连接是否正确。

八、采购与资料

欲获得完整电气参数、典型应用电路、封装图和推荐 PCB 布局,请参阅 SGMICRO 官方数据手册与参考设计;型号后缀 BYG/TR 的包装信息适用于批量 SMT 生产与料带交付。若需进一步技术支持,可联系厂商或授权分销商获取评估板与应用笔记。

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