WMSIC Electronic Components

SGMICRO SGM803-ZXN3L/TR SGM803

ModelSGM803-ZXN3L/TR
PackageSOT-23
BrandSGMICRO
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 24+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
SGMICRO SGM803-ZXN3L / TR
Type
SGMICRO
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
SGMICRO
Electronic Component
SGM803-ZXN3L/TR
Electronic Component
1
Package
SOT-23
Electronic Component
Supervisorand positions IC
Electronic Component
0.039g
Electronic Component
1
Electronic Component
BM0209744218
Operating Temperature
40℃~+125℃
ICType
Voltage Supervisor
Output Type
Electronic Component
Voltage
2.32V
Static Current(Iq)
13uA
Reset Level
Level
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SGM803-ZXN3L/TR 产品概述

一、产品简介

SGM803-ZXN3L/TR 是由圣邦微(SGMICRO)推出的一款高性能监控和复位芯片,采用 SOT-23 封装,专为电源管理和系统复位设计。该芯片具备卓越的性能,能够确保电路在工作状态下的稳定性和可靠性,广泛应用于消费电子、工业控制、汽车电子等领域。

二、主要功能

  1. 电源监控:SGM803-ZXN3L/TR 具有待机电压监测功能,能够监测给定电压(如 VCC)的变化。一旦工作电压下降到设定的阈值(掉电电压),芯片会及时发出复位信号,确保微处理器和其他数字电路操作的安全与稳定。

  2. 复位功能:当电源电压不足时,SGM803-ZXN3L/TR 会输出高信号(复位信号),确保系统在电压恢复到正常水平后,能够顺利地重新启动。这一特性对于避免系统在未完全上电时出现错误操作至关重要。

  3. 快速复位:该芯片内置较短的延迟时间,可在电压恢复之后迅速解除复位状态,使系统能够快速响应,减少启动时间,提高系统效率。

  4. 低功耗设计:SGM803-ZXN3L/TR 采用先进的低功耗技术,待机功耗极低,有效延长了电池供电设备的使用寿命,特别适合于便携式电子产品。

  5. 多种选项与兼容性:该芯片提供多个型号,用户可以根据特定的电压需求选择不同的器件,满足不同系统的需求。同时,其 SOT-23 封装也确保了与传统元器件的兼容性,便于在现有电路中替换或添加。

三、典型应用

SGM803-ZXN3L/TR 被广泛应用于多种场景中,包括但不限于以下几个方面:

  1. 消费电子:如智能手机、平板电脑、笔记本电脑等便携式设备中,用于进行电源监控和复位,确保设备在任何条件下都能够正常启动。

  2. 工业控制:在工业自动化设备、传感器网络中,该芯片帮助确保系统的可靠性与稳定性,尤其是在电源不稳的环境中。

  3. 汽车电子:在汽车电子设备(如导航系统、车载娱乐系统等)中,SGM803-ZXN3L/TR 提供关键的电源监控与复位功能,增强汽车系统的安全性。

  4. 医疗设备:如监护仪、诊断设备等,确保设备在关键时刻的可靠工作,对设备的稳定性与安全性要求极高,SGM803-ZXN3L/TR 的应用显得尤为重要。

四、技术参数

  • 工作电压范围:通常在 1.6V 到 5.5V 之间,满足大多数低电压应用的需求。
  • 复位电压阈值:具体的电压阈值可根据具体型号选择,支持用户的个性化需求。
  • 工作温度范围:-40°C 到 +125°C,适应各种严酷的工作环境。
  • 封装形式:SOT-23,适合高度集成的小型电路设计。

五、总结

SGM803-ZXN3L/TR 作为一款高性能的监控和复位芯片,以其卓越的稳定性、低功耗和多种应用场景的兼容性,成为电源管理和系统复位领域的重要解决方案。无论是在消费电子、工业控制还是汽车电子等多种应用中,其出色的性能都为系统的安全性与可靠性提供了保障,是设计师和工程师的理想选择。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.