WMSIC Electronic Components

SGMICRO SGM9111YC5/TR SGM9111YC5

ModelSGM9111YC5/TR
PackageSC70-5
BrandSGMICRO
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 24+

Available for RFQ

Technical data

Product details

17 specifications

Core information

Product name
SGMICRO SGM9111YC5 / TR
Type
SGMICRO
Minimum package
3000

Technical parameters

Electronic Component
SGMICRO
Electronic Component
SGM9111YC5/TR
Electronic Component
1
Package
SC70-5
Electronic Component
Buffers / Drivers / Transceivers
Electronic Component
SGM9111
Electronic Component
0.034g
Electronic Component
1
Features
Level Conversion
Electronic Component
BM0227710932
Operating Temperature
40℃~+85℃
Operating Voltage
3V~5.5V
Static Current(Iq)
10.1mA
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SGM9111YC5/TR 产品概述

一、产品简介

SGM9111YC5/TR 是圣邦微(SGMICRO)推出的一款小封装缓冲器/驱动器/收发器器件,属于 SGM9111 系列。器件工作电压范围为 3.0V 至 5.5V,适配常见单电源低压数字系统与接口驱动需求,工作温度覆盖工业级 -40℃ 到 +85℃。封装为 SC70-5(5 引脚小型封装),适合对 PCB 面积和空间有严格限制的便携及嵌入式应用。

二、主要参数

  • 输出类型:补充型(适用于互补推挽/补偿输出场合)
  • 工作电压:3.0V ~ 5.5V
  • 工作温度:-40℃ ~ +85℃
  • 静态电流(Iq):10.1 mA(典型/静态工作电流,请依据数据手册确认具体条件)
  • 系列:SGM9111
  • 封装:SC70-5
  • 品牌:SGMICRO(圣邦微)
  • 订购信息后缀:TR 表示卷带包装(Tape & Reel),便于自动贴片生产线使用

三、功能与特点

  • 低压兼容:支持 3V 至 5.5V 单电源工作,方便与 MCU/FPGA 等逻辑电平直接接口。
  • 小封装:SC70-5 封装体积小,便于满足空间受限应用的布局需求。
  • 适用范围广:作为缓冲器与驱动器,可用于信号整形、驱动下游负载或实现简单的收发功能。
  • 稳定性与可靠性:工作温度覆盖工业级范围,适合多种工作环境。

四、典型应用场景

  • MCU/FPGA 的缓冲与电平驱动
  • 低电压数字接口的收发与隔离
  • 小信号继电器、开关或指示电路驱动(须参考最大输出电流)
  • 空间有限的消费电子与便携设备

五、使用建议与注意事项

  • 查阅完整数据手册:在布局与选型时务必参考官方数据手册,确认引脚功能、最大额定值、电流能力、开关特性与热限制。
  • 电源去耦:在 VCC 引脚附近放置合适的去耦电容(如 0.1 μF),以抑制瞬态干扰并提高稳定性。
  • PCB 布局:输入/输出线尽量短直,避免长走线引发串扰或振铃,驱动大容性负载时注意回流路径与阻尼。
  • 功耗评估:静态电流约 10.1 mA,作为常开电路时需在系统功耗预算中考虑;频繁切换时也要关注动态损耗。
  • 封装与焊接:SC70-5 为小型贴片封装,使用卷带包装(TR)便于 SMT 贴装;焊接时注意温度曲线以保护器件。

若需进一步资料(如引脚功能图、时序、最大输出电流和典型波形),建议参考圣邦微官方 SGM9111 数据手册或联系供应商获取样片与评估板。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.