Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
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Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
SAMSUNG(三星)CL10A225KA8NNNC是一款表面贴装多层陶瓷电容器(MLCC),具有2.2μF的电容量,适用于通用电子应用。该产品的额定电压为25V,温度系数为X5R,适合在宽范围的温度条件下使用(-55°C到85°C)。其封装尺寸为0603(1.60mm x 0.80mm),厚度最大为0.035”(0.90mm),具有±10%的电容容差。
高可靠性: CL10A225KA8NNNC采用的是多层陶瓷技术,保证了其在可靠性和稳定性方面的优秀表现。通过严格的制造工艺控制,能够有效防止各种外部环境对电容特性的影响。
温度适应性: 该电容的温度范围非常广泛,能够在-55°C到85°C的环境条件下稳定工作。这使其特别适合航空航天、汽车以及工业控制等领域,满足高温或极端低温的工作环境需求。
小型封装: 封装尺寸采用0603规格,有助于节省电路板空间,满足现代电子产品对小型化的要求。对于空间受限的设计,CL10A225KA8NNNC是一个理想的选择。
多功能应用: 作为一款通用电容器,其可以在不同的电路中发挥作用,如去耦、旁路、滤波以及能量存储等功能,广泛应用于消费类电子、通讯设备、计算机和汽车电子等领域。
稳定性和一致性: 采用X5R温度特性,能够在较大的温度变化范围内保持较好的电容稳定性。对电容值的严谨控制(±10%)使得其在各类应用中具备良好的品质一致性。
CL10A225KA8NNNC广泛应用于多个电子产品领域,主要包括但不限于:
SAMSUNG CL10A225KA8NNNC是一款具有广泛适用性的高品质表面贴装多层陶瓷电容器,其卓越的性能特点使其在现代电子设备设计中不可或缺。其小巧的体积与高可靠性,使得此款电容器适合多种应用场景,为工程师在电路设计与实现中提供了出色的解决方案。在选择电容器时,CL10A225KA8NNNC凭借其稳定性和优良的规格参数,将成为用户的优选。
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Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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