Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
CL03A225MQ3CSNC
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- SAMSUNG CL03A225MQ3CSNC
- Type
- SAMSUNG
- Minimum package
- 10000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- SAMSUNG
- Electronic Component
- CL03A225MQ3CSNC
- Electronic Component
- 1
- Electronic Component
- 2.2uF
- Package
- 0201
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±20%
- Electronic Component
- 0.09g
- Electronic Component
- 1
- Electronic Component
- BM0265115741
- Electronic Component
- X5R
- Voltage
- 6.3V
- Electronic Component
- Electronic Component
- Electronic Component
- 10000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
三星CL03A225MQ3CSNC贴片陶瓷电容（MLCC）产品概述
一、产品核心定位与类型
三星CL03A225MQ3CSNC是一款多层陶瓷贴片电容（MLCC），由三星电机（Samsung Electro-Mechanics）生产，属于通用型小型化电子元器件。该产品针对低电压、高密度贴装场景设计，广泛应用于消费电子、物联网等小型化设备的电路滤波、耦合及电源管理环节，是电子设备中实现信号稳定与电源降噪的核心基础器件之一。
二、关键参数与性能解析
该产品核心参数清晰明确，覆盖多场景基础需求：
- 容值与精度：标称容值2.2μF（三位数代码标注“225”，即22×10⁵pF），精度±20%，满足一般电路容值误差要求；
- 额定电压：6.3V，适配3.3V、5V等常见低电压供电系统，安全余量充足，避免过压损坏；
- 温度系数：X5R（EIA标准），工作温度范围-55℃~+85℃，容值变化控制在±15%以内，温度稳定性优于Y5V等低阶介质，可适应多数室内外环境；
- 介质特性：陶瓷多层介质，通过堆叠工艺平衡高容值与小型化，无极性设计简化电路布线。
三、封装与尺寸规格
采用0201英制封装（对应公制0402封装），是当前贴片电容中尺寸极小的类型之一，三星标准尺寸为：
- 长度：0.60±0.05mm；
- 宽度：0.30±0.05mm；
- 厚度：0.30±0.03mm； 超小封装可显著节省PCB空间，适配智能手机、TWS耳机等高密度设计产品，支持自动化贴装（SMT），生产效率高。
四、品牌与可靠性保障
三星作为全球MLCC主要供应商，该产品具备可靠品质：
- 环保合规：无铅制程，符合RoHS 2.0、REACH等国际标准，无铅、镉、汞等有害物质；
- 可靠性测试：通过高温高湿（85℃/85%RH）、温度循环（-55℃+85℃）、振动（102000Hz）等严苛验证，确保长期稳定性；
- 批量一致性：大规模自动化生产工艺成熟，参数一致性好，适合电子厂商量产需求。
五、典型应用场景
因小型化、性能均衡，广泛应用于：
- 消费电子：智能手机、智能手表等可穿戴设备的电源滤波、音频耦合；
- 无线通信：蓝牙耳机、TWS耳机、Wi-Fi模块的射频电路滤波；
- 物联网（IoT）：传感器节点、智能家居设备（如智能灯泡）的低功耗电路降噪；
- 小型电源：便携式充电宝、移动电源的输出滤波电路。
六、产品优势总结
核心优势可概括为三点：
- 小型化适配：0201封装满足设备轻薄化需求，助力高密度PCB设计；
- 性能稳定：X5R温度系数保障宽温容值稳定，6.3V电压适配主流低电压系统；
- 成本可控：通用型参数与大规模量产能力，平衡性能与成本，适合中低端至中端设备批量应用。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
