Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
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Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
三星CL05Y474KP5VPNC是一款针对小型化电子设备设计的多层陶瓷贴片电容(MLCC),凭借紧凑的0402封装、稳定的X7S温度特性及适配低电压电路的10V额定电压,成为消费电子、IoT终端等领域的主流选型之一。以下从核心参数、封装特性、电气性能等维度展开详细概述。
该型号的编码遵循三星MLCC通用命名规则,关键参数可通过型号直接解析:
核心参数汇总:
参数类型 规格值 关键说明 容量 470nF(±10%) 适配低功耗电路滤波/耦合需求 额定电压(DC) 10V 满足3.3V/5V供电系统降额要求 温度范围 -55℃~+125℃ X7S工业级温度特性 封装尺寸 0402(1005) 公制1.0mm×0.5mm×0.5mm(典型) 材质 多层陶瓷 低寄生参数、高可靠性0402封装是目前电子设备小型化的主流封装之一,三星CL05Y系列针对该封装优化了陶瓷叠层结构:
X7S是工业级温度系数,相比普通X5R(仅支持+85℃),可覆盖更宽的温度场景:
三星CL05Y474KP5VPNC的参数特性使其适配以下场景:
三星作为全球MLCC龙头,CL05Y系列通过严格的可靠性测试,确保长期稳定工作:
若需调整参数,可参考以下替换方案:
综上,三星CL05Y474KP5VPNC以小体积、宽温稳定、低电压适配为核心优势,是小型化电子设备中电源滤波、信号耦合的高性价比选型,同时符合环保及可靠性要求,适配多领域应用需求。
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Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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