WMSIC Electronic Components

CL05Y474KP5VPNC

ModelCL05Y474KP5VPNC
Package0402
BrandSAMSUNG
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

18 specifications

Core information

Product name
SAMSUNG CL05Y474KP5VPNC
Type
SAMSUNG
Minimum package
10000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
SAMSUNG
Electronic Component
CL05Y474KP5VPNC
Electronic Component
1
Electronic Component
470nF
Package
0402
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±10%
Electronic Component
0.013g
Electronic Component
1
Electronic Component
BM0265916335
Electronic Component
X7S
Voltage
10V
Electronic Component
Electronic Component
Electronic Component
10000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

三星CL05Y474KP5VPNC多层陶瓷贴片电容(MLCC)产品概述

三星CL05Y474KP5VPNC是一款针对小型化电子设备设计的多层陶瓷贴片电容(MLCC),凭借紧凑的0402封装、稳定的X7S温度特性及适配低电压电路的10V额定电压,成为消费电子、IoT终端等领域的主流选型之一。以下从核心参数、封装特性、电气性能等维度展开详细概述。

一、产品核心参数与型号解码

该型号的编码遵循三星MLCC通用命名规则,关键参数可通过型号直接解析:

  • 型号前缀:CL代表三星多层陶瓷电容(MLCC);
  • 封装代码:05对应行业标准0402封装(公制:1.0mm×0.5mm);
  • 温度特性:Y代表X7S(-55℃~+125℃温度范围内,容量变化±22%);
  • 容值编码:474=47×10⁴pF=470nF(0.47μF);
  • 精度代码:K对应±10%容量误差;
  • 电压代码:P对应10V直流额定电压;
  • 后缀VPNC为三星内部生产批次代码,不影响核心性能。

核心参数汇总:

参数类型 规格值 关键说明 容量 470nF(±10%) 适配低功耗电路滤波/耦合需求 额定电压(DC) 10V 满足3.3V/5V供电系统降额要求 温度范围 -55℃~+125℃ X7S工业级温度特性 封装尺寸 0402(1005) 公制1.0mm×0.5mm×0.5mm(典型) 材质 多层陶瓷 低寄生参数、高可靠性

二、封装与尺寸特性

0402封装是目前电子设备小型化的主流封装之一,三星CL05Y系列针对该封装优化了陶瓷叠层结构:

  • 尺寸紧凑:公制1.0mm(长)×0.5mm(宽),厚度约0.5mm,可显著降低PCB占用面积,适配智能手表、蓝牙耳机等高密度设计;
  • 无引线设计:贴片式结构减少寄生电感(典型值<1nH)和寄生电阻(典型值<10mΩ),适合高频信号传输(如蓝牙、WiFi模块);
  • 焊接兼容性:支持无铅回流焊工艺,符合RoHS/REACH环保标准,适配现代电子制造流程。

三、电气性能与温度稳定性

3.1 电气核心性能

  • 容量稳定性:在额定电压及25℃下,容量偏差控制在±10%以内,满足滤波电路的精准性要求;
  • 损耗角正切(tanδ):1kHz测试条件下典型值<5%,低损耗特性减少能量消耗,适合长期工作的低功耗设备;
  • 额定电压:10V DC为低电压电路的安全设计范围,若采用3.3V/5V供电,可实现30%以上的降额使用,进一步提升可靠性。

3.2 温度特性(X7S)

X7S是工业级温度系数,相比普通X5R(仅支持+85℃),可覆盖更宽的温度场景:

  • 温度范围:-55℃(低温启动)~+125℃(高温工作);
  • 容量变化:在全温度范围内,容量变化率≤±22%,满足户外IoT终端、车载辅助电路等温度波动大的应用需求。

四、典型应用场景

三星CL05Y474KP5VPNC的参数特性使其适配以下场景:

  1. 消费电子:智能手机主板的电源滤波、智能手表的传感器耦合电路、蓝牙耳机的射频匹配;
  2. IoT终端:低功耗传感器节点(如温湿度传感器)的供电稳压、智能门锁的控制电路;
  3. 小型化设备:可穿戴手环、智能戒指的核心电路;
  4. 工业辅助电路:小型PLC的输入输出模块、低电压传感器的信号滤波;
  5. 车载辅助系统:车载USB充电模块、后视镜控制电路(符合X7S温度范围)。

五、可靠性与质量保障

三星作为全球MLCC龙头,CL05Y系列通过严格的可靠性测试,确保长期稳定工作:

  • 高温存储测试:125℃环境下存储1000h,容量变化<±10%,无开路/短路;
  • 温度循环测试:-55℃~+125℃循环1000次,性能无衰减;
  • 湿度测试:85℃/85%RH环境下1000h,容量变化<±15%;
  • 焊接可靠性:回流焊后无焊点开裂、电容脱落等问题,适配批量生产。

六、选型与替换参考

若需调整参数,可参考以下替换方案:

  • 同参数替换:村田GRM155C81H474KA01D(10V、±10%、X7S、0402);
  • 电压升级:三星CL05Y474KQ5VPNC(16V额定电压,Q为电压代码);
  • 精度升级:三星CL05Y474KQ5VBNC(±5%精度,B为精度代码);
  • 温度特性升级:若需更高温度(如+150℃),可选择三星CL05X474KP5VPNC(X7R特性)。

综上,三星CL05Y474KP5VPNC以小体积、宽温稳定、低电压适配为核心优势,是小型化电子设备中电源滤波、信号耦合的高性价比选型,同时符合环保及可靠性要求,适配多领域应用需求。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.