Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
CL05A105KQ5NNNC 是一款高性能的多层陶瓷电容(MLCC),由三星电子(SAMSUNG)生产。该电容具有额定电压6.3V,电容值为1µF,适用于多种电子电路的通用应用。其选用的X5R介质材料使其具备良好的温度稳定性和特性,能在-55°C到85°C的广泛温度范围内稳定工作,使其适合多种环境条件下的应用。
高精度和稳定性:该电容的容差为±10%,确保了其在各种电路中所需的精准性能。由于采用X5R介质,其电容值在温度变化和施加电压变化时,变化较小,能够保证电路的稳定运行。
尺寸小巧:0402封装使得该电容在保持高性能的同时,能够极大地节省PCB的板空间,对于追求轻薄小巧的电子产品尤为重要。
温度范围广:从-55°C到85°C的工作温度范围使得此电容可以在极限条件下运行,广泛应用于汽车电子、消费电子和工业设备中,确保其在不同的环境中都能稳定工作。
适用性强:该电容的通用应用特性使其适合多种电路设计,包括去耦、滤波和能量存储等功能,是现代电子设计中不可或缺的组件。
CL05A105KQ5NNNC贴片电容广泛应用于各类电子产品之中,尤其适用于以下领域:
消费电子:如智能手机、平板电脑、笔记本电脑等,能够有效降低噪声并提高电路的稳定性。
工业设备:在机械控制和数据采集设备中,要求严格的环境适应性和可靠性。
汽车电子:汽车电子组件要求高可靠性和耐温性,CL05A105KQ5NNNC能够满足此类需求。
医疗设备:此电容的稳健特性适合用于要求高精度和高可靠性的医疗电子设备。
作为一种表面贴装组件,CL05A105KQ5NNNC电容的安装方式相对简单,可以通过回流焊接等常规的装配方式快速安装。设计师在使用时需注意电路板设计中,合理布局以防止因过高的温度或电压引起的电容失效。同时,由于其较小的封装尺寸,需考虑到PCB的走线设计,确保与电路的良好连接。
CL05A105KQ5NNNC不仅在电气性能上表现出色,其优质的制造工艺和广泛的应用范围,使其成为电子设计师的首选元件之一。这款三星的贴片电容是现代电子产品设计中不可缺少的基石,能够满足日益增长的高性能需求,为各类设备的功能增强提供了可靠保障。无论是在消费电子、工业设备还是在严苛的汽车和医疗应用中,CL05A105KQ5NNNC都能展示其卓越的性能和适用性。
Request for quote
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products